Inner-cooling bonded abrasive grinding disc

Abstract

The invention relates to an inner-cooling bonded abrasive grinding disc, belongs to the field of bonded abrasive grinding and processing, and particularly relates to an inner-cooling bonded abrasive grinding disc used for single-side grinding or double-side grinding materials of silicon, sapphire, ceramic, glass and the like. Cooling liquid circulating channels are arranged inside the grinding disc. The grinding disc comprises multi-hole grinding blocks, a base plate and a spreader plate. The multi-hole grinding blocks are provided with abrasives, the base plate is provided with a plurality of hole channels, and a central hole and a groove are reserved on the spreader plate. Each multi-hole grinding block is fixed at one end of the hole channel of the base plate through bonding agents, and the large air holes in the multi-hole grinding blocks are communicated with one another. The cooling liquid circulating channels are formed by the central hole of the spreader plate, the grooves of the spreader plate, the radial grooves of the spreader plate, the hole channels of the base plate and the large air holes of the multi-hole grinding blocks. Since the grinding disc is provided with inner-cooling circulating channels, cooling effect can be improved, the grinding disc and workpieces can be prevented from being burnt off, size accuracy of the processing workpiece is high, and surface roughness is good.

Description

technical field [0001] The invention belongs to the field of solidified abrasive grinding and processing, and in particular relates to an internally cooled solidified abrasive grinding disc used for single-sided or double-sided grinding of materials such as silicon wafers, sapphires, ceramics and glass. Background technique [0002] Consolidated abrasive grinding refers to the process of consolidating the abrasive in the grinding block with a binder, bonding the grinding block to the substrate to form a grinding disc, and grinding the workpiece. There are mainly two methods of single-side grinding and double-side grinding. . Compared with free abrasive grinding, fixed abrasive grinding has the advantages of high grinding efficiency and good surface quality, so it is widely used and is often used to process materials such as silicon wafers, sapphire, ceramics and glass. A large amount of heat is generated during the grinding process of fixed abrasives, so coolant is required...

AI Technical Summary

Problems solved by technology

[0003] In summary, the existing cooling methods for fixed abrasive grinding discs have the following disadvantages: First, in the actual grinding process, the high-speed rotation and strong pressure of the grinding machine will generate a lot of heat on the surface of the grinding disc, requiring a large amount of cooling liquid Cooling the processing area, the utilization rate of the coolant is low, resulting in waste of resources, and the cooling effect is poor, it is easy to burn the grinding disc and the workpiece to be ground, so that the life of the grinding disc is shortened, and the quality of the processed workpiece is deteriorated; second, during the grinding process, it will A large amount of grinding debris is generated. The existing grinding method is not conducive to the discharge of grinding debris, and it is easy to cause grinding debris to accumulate in the air holes of the grinding disc grinding block, causing the grinding disc to be blocked, making the self-sharpening of the grinding disc worse, and the processing efficiency is reduced. It is easy to cause burns to the grinding disc and the workpiece

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