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Laser adhesive-removing process

A laser and process technology, applied in laser welding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of destroying mobile phone PCB boards, spending time fatigue, scraping off solder balls, etc., to improve the yield of rework and reduce consumption time, the effect of improving yield

Inactive Publication Date: 2013-06-26
LASER TEK TAIWAN
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  • Claims
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Problems solved by technology

[0005] It can be seen from the figure that epoxy resin 61 is often used in BGA packaging technology to achieve a fixed effect, and epoxy resin 61 is a thermosetting plastic, and epoxy resin 61 can be quickly removed by high temperature, but if the temperature is too high, the mobile phone will be damaged PCB board 6, so when the mobile phone is broken and sent for repair, the epoxy resin 61 on the BGA is often scraped off manually. This method often causes the solder ball to be scraped off during the scraping process, or the surrounding Small parts are scraped off, resulting in damage to the electronic components 61, and the time spent on manual scraping is also more likely to cause fatigue

Method used

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Embodiment Construction

[0045] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and implement it, but the examples given are not intended to limit the present invention.

[0046] Please refer to FIG. 2; FIG. 2 is a flow chart of the laser degumming process of the present invention.

[0047] As can be seen from the figure, the laser deglue process of the present invention has the following steps:

[0048] A. Loading 1: Loading 1 of electronic components on a platform.

[0049] B. Image positioning 2: Use the image positioning device of image positioning 2 to measure and position the volume on the electronic component.

[0050] C. Thickness measurement sensor 3: Use the sensing device of thickness measurement sensor 3 to detect the epoxy resin coating thickness and coating area on the BGA package on the electronic component.

[0051] D. Laser glue r...

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Abstract

A laser adhesive-removing process mainly includes a feeding step, an image locating step, a thickness measuring and sensing step, a laser adhesive-removing step and a blanking step, and achieves effects of removing epoxy resin on a printed circuit board (PCB) through laser, removing adhesives in a non-contact mode through a laser device, and preventing laser energy from being too strong and damaging the PCB after data comparison of a database. Therefore, the laser adhesive-removing process is a method which can effectively save time and improve yields.

Description

technical field [0001] The invention relates to a laser deglue process; more specifically, it refers to using laser to remove the epoxy resin on the BGA package of the PCB board, and using the data comparison in the database to find out the relative resistance of the solder balls. High temperature, avoiding laser damage to solder balls, and using laser can remove epoxy resin more quickly, and improve the yield rate of repairing PCB boards. Background technique [0002] With the progress of the times, the volume of mobile phones tends to become smaller and smaller, and the functions are also diversified, such as the current smart phones, but the precision electronic instruments are often used, so the failure rate will be high, and they are not resistant to falling , and now mobile phone motherboards use BGA packaging technology. [0003] Ball format packaging (Ball Grid Array, BGA, also known as solder ball array package or tin foot package), BGA packaging technology is ofte...

Claims

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Application Information

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IPC IPC(8): B23K26/14B23K26/36B23K26/02B23K26/402B23K26/70
Inventor 黄文志吴志伟李政恒苏柏年蔡宗坤史伟志
Owner LASER TEK TAIWAN
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