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Double-interface card production process

A dual-interface card and production process technology, which is applied to record carriers, instruments, computer parts, etc. used in machines, can solve the problems of cumbersome groove milling process, module scratches, and large loss, so as to achieve simple process and improve production efficiency. and quality effects

Inactive Publication Date: 2013-06-19
江苏远洋数据股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The slot milling process is cumbersome and requires secondary slot milling, especially for thread pick-up. Low efficiency may also cause damage to the coil. During the positioning of the module by the soldering iron, the module is easily scratched by the soldering iron, resulting in large losses and waste. Card

Method used

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Examples

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Embodiment Construction

[0032] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0033] according to figure 2 , the production process of the dual-interface card of the present invention is as follows: obtain PVC sheets through plate-making design, film plate-making, and printing, obtain the winding layer 2c through picking and PVC winding, and make it through lamination, lamination and punching processes Card 2, the milling machine mills out the coil 1 and mills off the paint layer on the surface of the coil 1 to expose the copper; after that, the module is tinned, milled flat, and glue is prepared, and the module is punched into small modules 5, and the copper wire of the coil on the card 2 4 (same as coil 1) apply solder paste 8 on the surface, manually fix the small module 5 in the card milling groove frame 3, and then perform hot pressing, electrical performance testing, personalization of card data, inspection, packa...

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PUM

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Abstract

The invention belongs to the field of double-interface cards, and particularly relates to a double-interface card production process. The process comprises the following steps: a), winding a coil on a coiling layer, folding, laminating and punching the coiling layer and polyvinyl chloride (PVC) sheets to form a card, wherein the coil is needed by a double-interface card; b), milling a groove on the punched card obtained by the step a) at two ends of the coil, adjusting the depth of the milling groove step by step until a paint layer of a copper wire of the coil is milled and copper is exposed; c), soldering, milling, gluing and punching on a module to obtain a small module; and d), dotting solder paste on the surface of the copper wire of the coil in a frame of the milling groove of the card, fixing the small module obtained by the step c) in the frame of the milling groove, and forming in a thermo-compression mode. Compared with an existing production process, the double-interface card production process is simple, groove milling is only needed once, through the solder paste, the module is enabled to be directly connected with the copper wire of the coil of which the paint layer is milled, package is finished through the thermo-compression, and production efficiency and quality are improved greatly.

Description

technical field [0001] The invention belongs to the field of dual-interface cards, and in particular relates to a production process for dual-interface cards. [0002] Background technique [0003] The existing dual-interface card production process is as follows: PVC sheets are obtained through plate-making design, film plate-making, and printing; winding layers are obtained through picking and PVC winding; cards are made through lamination, lamination, and punching processes, and then The coil is milled out by a slot milling machine, one end of the copper wire is picked out to an appropriate length, the excess tin on the front end of the copper wire is cut off, and the bottom is milled out by a slot milling machine. After that, the module is tinned, milled flat, and glue is prepared. The module is cut into small modules, and then the module and the copper wire are welded with an electric soldering iron. Inspection, packing, storage (see figure 1 ). [0004] The slot mi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077
Inventor 沈博珩陈华
Owner 江苏远洋数据股份有限公司
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