Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Multi-chip integration E band receiving module

A multi-chip integration and receiving module technology, applied in electrical components, transmission systems, etc., can solve the problems of large size, low integration of millimeter wave modules, complex system circuits, etc., and achieve good port performance, compact structure, and high integration. Effect

Active Publication Date: 2013-06-12
SOUTHEAST UNIV
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It realizes the down-conversion function from E-band to X-band in one module, which can overcome the disadvantages of low integration of millimeter-wave modules, complex system circuits, and large volume in the prior art.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-chip integration E band receiving module
  • Multi-chip integration E band receiving module
  • Multi-chip integration E band receiving module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] Below in conjunction with specific embodiment, further illustrate the present invention, should be understood that these embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention, after having read the present invention, those skilled in the art will understand various equivalent forms of the present invention All modifications fall within the scope defined by the appended claims of the present application.

[0027] Such as figure 2 , image 3 , Figure 4 with Figure 5 As shown, this embodiment includes a metal upper pedestal 61 and a metal lower pedestal 62, and the cavity formed by the metal upper pedestal 61 and the metal lower pedestal 62 is respectively provided with the first part of the SMA to microstrip transition 1 and the intermediate frequency low-pass filter circuit 2, referred to as the first circuit; the local oscillator circuit, including the local oscillator amplifier chip 4, the m...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a multi-chip integration E band receiving module which comprises an upper metal base and a lower metal base, a medium-frequency low-pass filtering circuit, and a local oscillator circuit and a down-conversion structure are respectively arranged in a cavity formed by the upper metal base and the lower metal base. A medium-frequency input end adopts a standard subminiature version A (SMA) connector, a local oscillator input end is of a standard waveguide flange structure, and the radio frequency output end is of a standard waveguide flange structure. Signal coupling between the waveguide and microstrip circuits of the module is achieved through a transitional structure, and a low-loss substrate circuit is connected with various functional gallium arsenide chips electrically. Based on the multi-chip integration technology, the multi-chip integration E band receiving module has the advantages of being compact in structure, high in integration degree, low in cost, good in consistency and convenient to manufacture in a large-scale mode.

Description

technical field [0001] The invention relates to the technical field of wireless communication, in particular to a multi-chip integrated E-band receiving module. Background technique [0002] Microwave is a common wireless communication technology. It is widely used in the relay and backhaul of various communication systems due to its long-distance, large capacity, fast deployment, and strong damage resistance. With the continuous mobile broadband bearer demand, conventional microwave spectrum resources from 6GHz to 38GHz have been rapidly exhausted, and it has become an inevitable trend for microwave communication to expand to higher frequency bands. The E-band microwave was released by the International Telecommunications Union Radio Organization (ITU-R) in 2001 and 2003, mainly including 60GHz and 80GHz high-frequency microwave communications. The 60GHz free frequency band was earlier used by the military and industry customers. For business operators, the 80GHz microwave...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H04B1/16
Inventor 杨非王宗新孟洪福崔铁军孙忠良
Owner SOUTHEAST UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com