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4,4'-bis(2,4-diamidophenoxy)biphenyl high-temperature-resistant epoxy adhesive and preparation method thereof

A technology of diaminobiphenyl epoxy resin and diaminophenoxy, applied in the direction of online phenolic epoxy resin adhesive, adhesive, epoxy resin glue, etc., can solve the problem of high price, unfavorable large-scale promotion and application, poly The high cost of ether imide resin achieves the effect of convenient operation, good application prospect and strong hydrophobicity

Inactive Publication Date: 2013-06-12
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0025] (2) Monomers such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) are expensive, resulting in high cost of polyetherimide resin (HPEI) and adhesives, which is not conducive to Large-scale promotion and application can only be limited to some special fields

Method used

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  • 4,4'-bis(2,4-diamidophenoxy)biphenyl high-temperature-resistant epoxy adhesive and preparation method thereof
  • 4,4'-bis(2,4-diamidophenoxy)biphenyl high-temperature-resistant epoxy adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Preparation of component A

[0045] Mix 100 g of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8) with 19.9 g (0.05 mol) of 4,4'- Bis(2,4-diaminophenoxy)biphenyl was put into a reaction kettle, heated to 50°C, and stirred for 2 hours to obtain 119.9 g of a homogeneous and transparent copolymer, designated as A1.

[0046] Mix 100 g of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8) with 15.9 g (0.04 mol) of 4,4'- Bis(2,4-diaminophenoxy)biphenyl was put into the reaction kettle, heated to 90°C, stirred and reacted for 0.5 hour to obtain 115.9 g of a homogeneous and transparent copolymer, designated as A2.

[0047] Diglycidyl 100 g of 4,5-epoxycyclohexane-1,2-dicarboxylate epoxy resin (epoxy value 0.85) was mixed with 18.7 g (0.047 mol) of 4,4'-bis(2,4 -diaminophenoxy)biphenyl was put into a reaction kettle, heated to 60° C., stirred and reacted for 1 hour to obtain 118.7 g of a homogeneous and transparen...

Embodiment 2

[0051] Preparation of Component B

[0052] At room temperature, put 39.8 grams (0.1 moles) of 4,4'-bis(2,4-diaminophenoxy)biphenyl and 830 grams of N,N-dimethylacetamide into the reaction kettle, stir and dissolve completely , add 104 g (0.2 mol) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride and 64.4 g (0.2 mol) of 3,3',4,4'- Tetracarboxybenzophenone dianhydride, stirred and reacted for 0.5-1 hour, obtained 1038.2 grams of homogeneous transparent solution, added 170 grams of toluene, heated to reflux, and carried out reflux water separation reaction, the temperature was 130 ° C, and the reaction time was 2 hours , After the reaction is completed, part of the organic solvent is separated so that its solid content is in the range of 15%-30%, which is denoted as B1.

[0053] At room temperature, mix 39.8 g (0.1 mol) of 4,4'-bis(2,4-diaminophenoxy)biphenyl with 100 g of N,N-dimethylacetamide and 536 g of N-methyl-2 - Pyrrolidone was added to the reactor, and afte...

Embodiment 3

[0056] Preparation of 4,4'-bis(2,4-diaminophenoxy)biphenyl type high temperature resistant epoxy adhesive

[0057] At room temperature, stir and mix components A and B according to the mass ratio of 1:1-2 to obtain a series of 4,4'-bis(2,4-diaminophenoxy)biphenyl type high temperature resistant rings Oxygen adhesive, denoted as HTEA-p, p is a natural number, the specific formula is shown in Table 1.

[0058] Table 1 Formula table of 4,4’-bis(2,4-diaminophenoxy)biphenyl type high temperature resistant epoxy adhesive Unit: gram

[0059] Component

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Abstract

The invention relates to a 4,4'-bis[4-(2,4-diamidophenoxy)phenyl]biphenyl high-temperature-resistant epoxy adhesive and a preparation method thereof. The 4,4'-bis(2,4-diamidophenoxy)biphenyl high-temperature-resistant epoxy adhesive is composed of a component A and a component B, wherein the component A is a copolymer prepared by reacting 4,4'-bis(2,4-diamidophenoxy)biphenyl and epoxy resin; and the component B is a homogeneous transparent solution with the solid content of 15-30%, which is prepared by reacting 4,4'-bis(2,4-diamidophenoxy)biphenyl and aromatic dibasic acid anhydride in a strong-polarity non-proton organic solvent and toluene. The preparation method comprises the following step: evenly mixing the component A and the component B in a mass ratio of 1:(1-2) at room temperature. The preparation technique is simple; and the adhesive has excellent comprehensive properties, can be widely used for bonding steel, copper, aluminum or any other metal with ceramic, glass, resin-base composite material or any other substrate, and has favorable industrialization prospects.

Description

technical field [0001] The invention belongs to the field of epoxy resin adhesives and preparation thereof, in particular to a 4,4'-bis(2,4-diaminophenoxy)biphenyl type high temperature resistant epoxy adhesive and a preparation method thereof. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, resin-based composite materials, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts. One of the main components of the mixture; (2) Good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) Go...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J163/04C09J11/08C08G59/50C08G73/10
Inventor 虞鑫海陈梅芳
Owner DONGHUA UNIV
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