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Composite adhesive for single-sided film reinforced little glue mica tape and preparation method thereof

A technology of mica tape with less glue and composite glue, which is applied in the field of insulating mica products, can solve the problems of unfavorable motor coil insulation treatment, poor compatibility of composite glue and mica, delamination of mica paper and film, etc., to achieve toughness improvement, tensile strength The effect of low strength and high mechanical strength

Active Publication Date: 2014-07-02
SUZHOU TAIHU ELECTRIC ADVANCED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The composite glue used in the manufacture of single-sided film reinforced mica tape with less glue is the main material that affects the performance of the product. The traditional composite glue uses organic resin as the matrix resin. Since mica paper is an inorganic mineral material, it is compatible with organic resin. The compatibility of the film is poor, and the mica paper and the film are prone to delamination after the mica tape is formed, which is not conducive to the insulation treatment of the motor coil
[0003] Therefore, in the prior art, the composite glue used in the manufacture of single-sided film reinforced mica tape with less glue has poor compatibility with mica

Method used

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  • Composite adhesive for single-sided film reinforced little glue mica tape and preparation method thereof
  • Composite adhesive for single-sided film reinforced little glue mica tape and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The present embodiment provides a kind of preparation method of the compound glue that is used for single-sided thin film reinforcement mica tape with few glues, and it comprises the following steps:

[0036] (1) Mix 10g of dodecyldimethylammonium chloride, 25g of nano-montmorillonite (MMT) and 65g of distilled water, and carry out ion-exchange organic reaction of aqueous solution at 60±5℃, and the reaction time is 5-6h , the reaction is over, filter, and after filtration, wash the filter cake with a solution of ethanol: water = 1:1 (volume ratio) until the washing liquid is washed with 0.1M AgNO 3 Titration without white precipitate; then vacuum drying at 110-120°C, crushing, and sieving to obtain organic nano-montmorillonite;

[0037] (2) Mix 2 g of organic nano-montmorillonite obtained in step (1), 200 g of CYD128 bisphenol A epoxy resin, add 200 g of acetone and toluene mixed solution (acetone:toluene=2:1 mass ratio), After being dispersed in the instrument for 2 h...

Embodiment 2

[0040] The present embodiment provides a kind of preparation method of the compound glue that is used for single-sided thin film reinforcement mica tape with few glues, and it comprises the following steps:

[0041] (1) Mix 10g of dioctadecyldimethylammonium chloride, 25g of nano-montmorillonite (MMT) and 65g of distilled water, and carry out ion-exchange organic reaction in aqueous solution at 60±5℃, and the reaction time is 5-6h After the reaction is completed, filter and wash the washing liquid with a solution of ethanol: water = 1:1 (volume ratio) until no white precipitate is formed by titration with 0.1M AgNO3; The organic nano-montmorillonite was prepared by sieving.

[0042] (2), mix 6g of organic nano-montmorillonite obtained in step (1), 200g of E44 bisphenol A epoxy resin, add 200g of acetone and toluene mixed solution (acetone: toluene = 2:1 mass ratio), in ultrasonic After being dispersed in the instrument for 2 hours, the intercalation reaction was carried out f...

Embodiment 3

[0045] The present embodiment provides a kind of preparation method of the compound glue that is used for single-sided thin film reinforcement mica tape with few glues, and it comprises the following steps:

[0046] (1) Mix 10g of dioctadecyldimethylammonium chloride, 25g of nano-montmorillonite (MMT) and 65g of distilled water, and carry out ion-exchange organic reaction in aqueous solution at 60±5℃, and the reaction time is 5-6h , the reaction is completed, filtered, and after filtration, wash the washing liquid with a solution of ethanol: water = 1:1 (volume ratio) to 0.1M AgNO 3 No white precipitate is formed during titration; then vacuum-dried at 110-120°C, pulverized and sieved to obtain organic nano-montmorillonite.

[0047](2), mix 10g of organic nano-montmorillonite obtained in step (1), 200g of E44 bisphenol A epoxy resin, add 200g of acetone and toluene mixed solution (acetone: toluene = 2:1 mass ratio), in ultrasonic After being dispersed in the instrument for 2 h...

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Abstract

The invention relates to a composite adhesive for a single-sided film reinforced little glue mica tape and a preparation method thereof. The composite adhesive comprises the following raw materials: 1-20 parts of organic nano montmorillonite, 100-500 parts of bisphenol A type epoxy resin, 100-400 parts of acetone and 50-200 parts of toluene, wherein the organic nano montmorillonite is obtained by performing an aqueous solution ion exchange organic reaction on nano montmorillonite and alkyl methyl ammonium salt for 2 to 12 hours; and the mass ratio of the feeding amount of nano montmorillonite to the feeding amount of alkyl methyl ammonium salt is 1:0.2-1. The composite adhesive is high in compatibility with mica paper, and the adhesion force between the mica paper and the substrate film can be improved. In addition, the composite adhesive is simple in preparation process, low in cost and high in mechanical strength, the condensate formed by matching with epoxy-acid anhydride type VPI paint has high thermal deformation temperature, high impact strength, high tensile strength and low dielectric loss and can be expected to be widely applied to the fields of insulated mica products and the like.

Description

technical field [0001] The invention belongs to the field of insulating mica products, and in particular relates to a composite glue for a single-sided thin-film reinforced mica tape with little glue used in a high-voltage motor and a preparation method for the composite glue. Background technique [0002] Single-sided film reinforced mica tape with less glue is a material used for winding insulation of high-voltage motor coils. It forms a unique insulation system with epoxy-acid anhydride VPI insulating varnish and other insulating materials. The composite glue used in the manufacture of single-sided film reinforced mica tape with less glue is the main material that affects the performance of the product. The traditional composite glue uses organic resin as the matrix resin. Since mica paper is an inorganic mineral material, it is compatible with organic resin. The compatibility of the film is poor, and the phenomenon of delamination between the mica paper and the film is p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J11/04B32B7/12
Inventor 黄芬景录如石兆丛蔡文银伍晓峰李翔王清国马俊锋
Owner SUZHOU TAIHU ELECTRIC ADVANCED MATERIAL CO LTD
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