Capacitance type pressure sensing conversion device and method of achieving capacitance type pressure sensing on low-end singlechip

Abstract

The invention discloses a capacitance type pressure sensing conversion device and a method of achieving capacitance type pressure sensing on a low-end singlechip. The capacitance type pressure sensing conversion device and the method of achieving capacitance type pressure sensing on the low-end singlechip comprise an elastic press key and a base plate, wherein the bottom surface of the elastic press key is coated with a conductive coating, the conductive coating is opposite to conductive copper foil on the base plate, and the conductive coating and the conductive copper foil form two poles of a capacitance. An elastic medium supporting piece is arranged between the elastic press key and the base plate, and a capacitance detection separation distance is kept between the elastic press key and the base plate. The elastic press key is pressed, and thereby the distance value of the capacitance detection separation distance is changed, and transformation output between pressing force and the capacitance change is generated. Electronic equipment of the low-end singlechip is combined with the capacitance type pressure sensing conversion device, the computer processing power of the low-end singlechip is fully utilized, the data processing efficiency is improved, and thereby the capacitance type pressure sensing conversion is achieved on an ordinary singlechip, and the ordinary singlechip has high-resolution output.

Description

technical field [0001] The invention relates to a capacitive pressure sensing conversion device, and also relates to a method for realizing capacitive pressure sensing on a low-end single-chip microcomputer by using the capacitive pressure sensing conversion device. Background technique [0002] The working principle of the existing capacitive pressure sensing conversion device is that two opposite electrodes are arranged under the pressure receiving surface, and a conductive medium is arranged between the electrodes to form a low-voltage AC electric field on the structure. When touching the pressure receiving surface and applying pressure, due to the characteristics of the electric field, a coupling capacitance will be formed between the conductor electrodes, and the current from the electrodes on the four sides will flow to the contacts, and the strength of the current and the finger pressure will change the distance to the two electrodes and form a Inversely proportional ...

AI Technical Summary

Problems solved by technology

The price of such pressure sensing parts is generally more expensive, and its power consumption is also high, which not only increases the manufacturing cost, but also requires a high-performance supporting power supply module, so it is currently possible to use pressure sensing conversion The device is only limited to high-end application equipment of some big manufacturers

Therefore, it is not suitable for the use of pressure sensing input on embedded devices with ultra-low power consumption (current consumption of tens of microamperes (uA) or even a few microamperes), such as: remote control

With the diversified development of electronic equipment, more and more low-end equipment also hope to develop diversified application solutions. Therefore, the use of general single-chip microcomputers as the design of the main control device equipment has become the bottleneck of its combination with pressure sensor conversion devices.

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