Slurry composition and use thereof

A composition and slurry technology, which is applied to polishing compositions containing abrasives, grinding machines, grinding devices, etc., can solve problems such as falling off from the machine, high grinding temperature, and grinding failure, and achieve improved stability and reliability. Higher temperature, lower grinding temperature, and better grinding quality

Active Publication Date: 2013-05-08
FERRO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the grinding process of sapphire substrate, the grinding temperature will be higher than 50°C, resulting in too high grinding temperature
However, when the grinding temperature is too high, the adhesion between the polishing pad and the surface of the machine platform will be reduced, and the polishing pad will be degummed or fall off from the machine, resulting in grinding failure.

Method used

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  • Slurry composition and use thereof
  • Slurry composition and use thereof
  • Slurry composition and use thereof

Examples

Experimental program
Comparison scheme
Effect test

experiment example 1

[0047]Experimental Example 1 is used to test the influence of the spherical factor of the abrasive grains in the slurry composition on the grinding temperature and removal rate. In Experimental Example 1, colloidal silica (colloidal silica) with an average particle diameter of 90 nanometers to 130 nanometers and a particle diameter polydistribution index of 1.0 to 1.4 was used as abrasive particles to prepare samples 1 to 4. For the slurry composition, the true spherical factor range, composition, ratio and pH value of the abrasive grains are shown in Table 1 below, and the rest of the abrasive composition is water.

[0048] Table 1

[0049]

[0050] figure 1 A scanning electron microscope photograph of sample 2 is shown. figure 2 A scanning electron microscope photograph of sample 4 is shown.

[0051] Please refer to figure 1 , due to the true spherical factor range of the abrasive grains of sample 2 is 0.7-1.0, so sample 2 contains a large number of elliptical abra...

experiment example 2

[0058] Experimental Example 2 is used to test the effect of additives in the slurry composition on the grinding temperature and removal rate. In Experimental Example 2, colloidal silica with an average particle size of 90 nm to 130 nm and a particle size polydistribution index of 1.0 to 1.4 was used as abrasive particles to prepare slurry compositions of samples 5 to 8, The true spherical factor range, composition, ratio and pH value of the abrasive grains are shown in Table 3 below.

[0059] table 3

[0060]

[0061] The experimental results of Experimental Example 2 are shown in Table 4 below.

[0062] Table 4

[0063]

[0064]

[0065] From the experimental results in Table 4 above, it can be seen that comparing the experimental results of samples 6-8 with sample 5, no matter adding surfactants (such as sodium lauryl sulfate and / or sodium lauryl glutamate) or Adding an antifoaming agent (such as polydimethylsiloxane) can further control the grinding temperature ...

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Abstract

The present invention provides a slurry composition and use thereof. The total amount of the slurry composition is 100wt%. Furthermore the slurry composition comprises grinding particles and a solvent. The content of the grinding particles is between 30wt% and 60wt%. Furthermore true ball factor of the grinding particles is 0.9-1.0. The content of the solvent is between 40wt% and 70wt%. The grinding composition can greatly reduce the grinding temperature.

Description

technical field [0001] The present invention relates to a composition and its use, in particular to a slurry composition and its use. Background technique [0002] In the very large scale integrated circuit (VLSI) process, chemical mechanical polishing (CMP) can provide global planarization of the wafer surface, especially when the semiconductor process enters the sub-micron (sub-micron) field Finally, chemical mechanical polishing is still an indispensable process technology. [0003] During the grinding process of the sapphire substrate, the grinding temperature will be higher than 50° C., which causes the grinding temperature to be too high. However, when the polishing temperature is too high, the adhesive force between the polishing pad and the platform surface of the machine will decrease, and the polishing pad will be degummed or fall off from the machine, which will cause grinding failure. Contents of the invention [0004] The invention provides a slurry composit...

Claims

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Application Information

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IPC IPC(8): C09G1/02C09K3/14B24B37/00
Inventor 郭哲宇蔡文财张松源陆明辉
Owner FERRO CORP
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