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Printed circuit comprising at least one ceramic component

A technology of printed circuit boards and components, which is applied in the direction of printed circuits, printed circuits, printed circuits assembled with electrical components, etc., and can solve problems such as increased thermomechanical stress, limitations, and reduced capacitor capacity

Active Publication Date: 2013-04-24
LABINAL POWER SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This temperature distribution limits the number of components that can be mounted in parallel
Furthermore, this temperature distribution can lead to a decrease in the capacity of the capacitors located furthest from the substrate, and especially when temperatures greater than 125°C are reached
Applicants have also found that use of prior art connectors increases thermomechanical stress in ceramic components

Method used

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  • Printed circuit comprising at least one ceramic component
  • Printed circuit comprising at least one ceramic component
  • Printed circuit comprising at least one ceramic component

Examples

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Embodiment Construction

[0047] figure 1 and figure 2 A printed circuit board according to a first embodiment of the present invention is shown. The printed circuit board comprises a substrate (1). The substrate ( 1 ) preferably comprises an assembly of one or more thin copper layers separated by insulating material. The insulating material may be, for example, polyamide, epoxy resin or fiberglass. The substrate (1) typically has a coefficient between 4 and 25 ppm / k.

[0048] The substrate (1) is parallel to the XZ plane.

[0049] The printed circuit board also includes three ceramic components (2, 3, 4) connected in parallel to the base plate (1). In this example, the number of ceramic parts connected in parallel is equal to three, but a different number of ceramic parts can be chosen without departing from the scope of the invention. Typically, a number n of ceramic components can be connected in parallel, where n is 1 or more.

[0050] In this embodiment the ceramic components ( 2 , 3 , 4 ) a...

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Abstract

The invention relates to a printed circuit comprising a substrate (1) onto which at least one ceramic component (2, 3, 4) is attached so as to enable the heat produced by the ceramic component (2, 3, 4) to be discharged and to prevent cracks in the ceramic component (2, 3, 4) and in the substrate (1). To this end, the ceramic component (2, 3, 4) is attached onto the substrate (1) by means of two connectors (5, 6) made of metal matrix composite material. Said two connectors further preferably have incisions so as to enable the mechanical stresses exerted in the substrate to be carried over into the connectors.

Description

technical field [0001] The invention relates to a printed circuit board comprising at least one electronic or electrical ceramic component. More specifically, the invention relates to a method for the assembly of electrical or electronic ceramic components on printed circuit boards, in particular when said printed circuit boards are in harsh environments on board, such as in turbine engines. Background technique [0002] The use of ceramic capacitors on electronic boards or assemblies poses reliability concerns, especially due to the brittle nature of ceramic capacitor materials. Indeed, ceramic cannot withstand mechanical stresses beyond its elastic limit and, therefore, it is prone to fracture. These cracks limit the capacity of the capacitor and can even lead to a loss of insulation. This problem is especially important in capacitors larger than 1 cm. [0003] Similarly, ceramic resistors also have reliability issues when mounted to a printed circuit board. This probl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G2/06H05K3/34
CPCH05K2201/10909H01G4/228H05K1/181H05K3/3426H01G4/12H01G11/22H01G2/065Y02E60/13Y02P70/50H01G2/06
Inventor 托尼·洛美奥
Owner LABINAL POWER SYST
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