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Method for producing polyimide film laminate, polyimide film laminate

A technology of polyimide film and manufacturing method, which is applied in polyamide coatings, chemical instruments and methods, coatings, etc., can solve problems such as uneconomical control and complexity, and achieve degassing suppression, good formability, and suppression of occurrence bubble effect

Active Publication Date: 2015-12-16
UBE IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, 2-layer formation is uneconomical due to an increase in the number of steps and control becomes complicated
In addition, since polyamic acid must be used to form a peeling resin layer, the same problem in forming a polyimide film cannot be sufficiently solved.

Method used

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  • Method for producing polyimide film laminate, polyimide film laminate
  • Method for producing polyimide film laminate, polyimide film laminate
  • Method for producing polyimide film laminate, polyimide film laminate

Examples

Experimental program
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Effect test

preparation example Construction

[0042]The preparation of polyamic acid can preferably employ the conventionally well-known method and conditions for preparing polyamic acid. Therefore, it is not particularly limited. For example, tetracarboxylic dianhydride and diamine are preferably mixed in an organic solvent at a concentration of about 5 to 50% by mass in terms of polyimide in order to suppress polyimide. The amide bond and the carboxyl group of the amic acid are imidized, preferably at 100° C. or lower, more preferably 80° C. or lower while stirring for 0.1 to several tens of hours to obtain a uniform polyamic acid solution. If the solid content concentration in terms of polyimide is less than 5% by mass, a large amount of solvent is used, which is uneconomical, and if the solid content concentration exceeds 50% by mass, the viscosity tends to be high, making handling, etc. difficult.

[0043] As the organic polar solvent used for the preparation of the polyamic acid, conventionally known organic polar s...

Embodiment 1

[0093] 400.0 g of N-methyl-2-pyrrolidone was added as a solvent in a glass reaction vessel with an internal volume of 500 ml equipped with a stirrer and a nitrogen gas introduction and discharge pipe, and 26.8801 g (0.2485 mol) of PPD and 73.1199 g (0.2485 mol) of s-BPDA was stirred at 50° C. for 10 hours to obtain a polyamic acid solution with a solid content concentration of 18.7%, a solution viscosity of 5 Pa·s, and a logarithmic viscosity of 0.65. To this polyamic acid solution composition, 50.0 g of xylene (11% by mass in the total solvent amount) was added to obtain a uniformly dissolved polyamic acid solution composition.

[0094] The polyamic acid solution composition was coated on a glass plate of the substrate using a bar coater, and the coating film was subjected to 10 minutes at 120°C and 150°C, 60 minutes at 180°C, 200°C, and 250°C. It heat-processed each for 10 minutes at 450 degreeC and 30 minutes at 450 degreeC, and obtained the laminated body which consists of...

Embodiment 2～7

[0098] As shown in Table 1, the same operation as in Example 1 was performed except that the kind, ratio, and heat treatment conditions of the mixed solvent were changed.

[0099] The results are shown in Table 1.

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Abstract

The present invention provides a method for producing a polyimide film laminate, wherein a polyamic acid solution composition comprising a polyamic acid having a specific chemical composition and a specific mixed solvent is applied to a substrate, and then, heat treatment under certain conditions. A method for producing a polyimide film laminate, wherein a coating film made of a polyamic acid solution composition is formed on the surface of a substrate to obtain a laminate formed of a substrate and a polyamic acid solution composition, followed by The laminate formed by the above base material and the polyamic acid solution composition is heat-treated for at least 10 minutes at a temperature range of greater than 150°C and less than 200°C, and then heat-treated at a maximum temperature of 400-550°C to obtain material and polyimide film, in the polyamic acid solution composition, 3,3',4,4'-biphenyltetracarboxylic dianhydride and / or pyromellitic dianhydride, and The polyamic acid of p-phenylenediamine is dissolved in the mixed solvent which contains the organic polar solvent and the solvent which azeotropes with water, and the ratio of the solvent which azeotropes with water in all solvents is 5-35 mass %.

Description

[0001] Relationship to Associated Application [0002] This application is an application claiming priority based on Japanese Patent Application No. 2010-165366 for which it applied to the Japan Patent Office on July 22, 2010, and the disclosure of this application is also incorporated by reference. technical field [0003] This invention relates to the manufacturing method of the polyimide film laminated body which laminated|stacked the polyimide film on the base material. In particular, it relates to a method for producing a polyimide film laminate, which is characterized in that a polyamic acid solution composition comprising a polyamic acid having a specific chemical composition and a specific mixed solvent is coated on a substrate, and then the The obtained laminate is heat-treated under specific conditions. Background technique [0004] 3,3',4,4'-biphenyltetracarboxylic dianhydride (hereinafter sometimes abbreviated as s-BPDA.) and / or pyromellitic dianhydride (hereina...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/34B32B15/088C08G73/10C08J5/22H05K1/03
CPCC08G73/1067C08J2379/08C08L79/08C08J7/0427H01L31/03926H05K1/0393H05K2201/0154Y10T156/10Y10T428/31721B32B15/088B32B27/34C08G73/10C08J5/22B32B27/281C09D177/10Y02E10/50
Inventor 中山知则园山研二中山刚成
Owner UBE IND LTD
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