Array substrate manufacturing method, array substrate and display device

Abstract

The invention discloses an array substrate manufacturing method, an array substrate and a display device and relates to the field of displaying, and the method is used for reducing the probability of breakage of signal wires and improving the product yield and is especially suitable for a high-resolution product with a narrow line width. The array substrate manufacturing method comprises the following steps of: forming a layer of repairing thin film on a layer in which the signal wire is positioned, wherein the repairing thin film is a transparent conductive doped semiconductor thin film or a transparent insulative semiconductor thin film; and performing conversion processing, wherein the repairing thin film in the first region is in a conductive state, the repairing thin film in other regions except for the first region is in an insulative state, and the first region is a region in which the signal wire is positioned. The array substrate comprises a display unit and the signal wire, wherein the repairing thin film is arranged on the layer in which the signal wire is positioned; and the repairing thin film is in the conductive state in the first region and is in the insulation state in other regions except for the first region.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a method for manufacturing an array substrate, an array substrate, and a display device. Background technique [0002] With people's continuous pursuit of display quality, high resolution has become a major trend in the development of displays. However, as the resolution of the display increases, the line width of the data line wiring also needs to be reduced accordingly, which puts forward higher requirements on the manufacturing process. [0003] When the display resolution is increased to 300ppi or even 400ppi, 500ppi and above, it is necessary to reduce the line width of the data line from above 4um to 2-3um (products with a resolution above 300ppi are called high-resolution products with narrow line width) or narrow line width products), and at present, the wet etching process is generally used to prepare the data lines and source and drain electrodes, but when the...

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Problems solved by technology

[0003] When the display resolution is increased to 300ppi or even 400ppi, 500ppi and above, it is necessary to reduce the line width of the data line from above 4um to 2-3um (products with a resolution above 300ppi are called high-resolution products with narrow line width) or narrow line width products), and at present, the wet etching process is generally used to prepare the data lines and source and drain electrodes, but when the line width of the data lines is reduced to 2-3um, due to the uniformity of wet etching, the data The wire is prone to broken wires, which seriously affects the yield of the product

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