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Preparation method of gold-tin alloy solder foil

A technology of tin alloy and foil materials, which is applied in the field of preparation of gold-tin alloy solder foil materials, can solve problems such as poor brazing performance, low production efficiency, and slow temperature response of gold-tin solder brazing

Inactive Publication Date: 2013-02-06
YUNNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The brazing temperature response of gold-tin solder prepared by composite method and composite diffusion method is slow and the brazing performance is poor
Ultrasonic casting and hot rolling method is to use ultrasonic casting to cast gold-tin alloy ingots and then hot-roll to obtain gold-tin alloy foils. Although the brazing performance of the prepared solder is good, the deformation of each pass needs to be controlled <0.5 % rolling, the production efficiency is low

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0016] Prepare fine-tuned gold-tin alloy raw materials, with a tin content of 20.2wt% and a gold content of 79.8wt%. It is melted in a graphite crucible and poured into a graphite mold at 300°C. The ingot is taken out and subjected to homogenization heat treatment at a temperature of 220°C. The heat treatment time 30~80 minutes. The ingot is then hot-rolled at 220°C, the deformation of each pass is controlled 5 minutes, and the final rolling thickness is 0.1mm.

Embodiment 2

[0018] Prepare fine-tuned gold-tin alloys, in which the tin content is 20.5wt%, and the gold content is 79.5wt%. It is melted in a graphite crucible and poured into a cold graphite mold at 340°C. The ingot is taken out and subjected to homogenization heat treatment at a temperature of 240°C. The time is 30~60 minutes, the microstructure of the ingot after homogenization heat treatment is as follows: figure 1 As shown, it is a uniform and fine two-phase eutectic structure. The ingot is then hot-rolled at 240°C, the deformation of each pass is controlled to be less than 30%, the intermediate annealing time is more than 5 minutes, and the final rolling thickness is 0.05mm. figure 2 Shown is the microstructure of the gold-tin alloy solder foil.

Embodiment 3

[0020] Prepare fine-tuned gold-tin alloys, in which the tin content is 20.7wt%, and the gold content is 79.3wt%. It is melted in a graphite crucible and poured into a cold graphite mold at 360°C. The ingot is taken out and subjected to homogenization heat treatment at a temperature of 260°C. Time 10~60 minutes. The ingot is then hot-rolled at 240°C, the deformation of each pass is controlled 5 minutes, and the final rolling thickness is 0.02mm.

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Abstract

The invention provides a preparation method of a gold-tin alloy solder foil, which relates to a manufacturing process of a refractory gold-base alloy material, particularly a preparation method of a gold-tin eutectic alloy solder foil. In the method, the composition is finely adjusted to prepare the gold-tin alloy, wherein the tin content in the alloy is 20.0-21.0%; graphite crucible smelting and graphite mold casting are adopted to obtain a fine ingot structure; and uniform heat treatment and 220-265 DEG C hot rolling are adopted, wherein the deformation amount of the gate is less than 30%, the heating time is longer than 5 minutes, and final rolling thickness is 0.02-0.1mm. The gold-tin alloy solder foil prepared by the method provided by the invention has the advantages of quick temperature response and favorable solderability. The method is simple and easy to implement, has the advantage of high production efficiency, and is suitable for industrial mass production.

Description

technical field [0001] The invention relates to a manufacturing process of difficult-to-process gold-based alloy materials, in particular to a preparation method of gold-tin eutectic alloy solder foil. Background technique [0002] Gold-tin eutectic alloy AuSn 20 Alloy, tin content 20wt%, gold content 80wt%, eutectic temperature 280 o c. Gold-tin eutectic alloy solder has excellent properties such as good electrical conductivity, high brazing strength and thermal fatigue strength, and is widely used in high-reliability microelectronic device packaging, using foil or preformed welding rings with specifications of 0.02~0.10mm. AuSn 20 The alloy is composed of two hard and brittle intermetallic compounds, and the alloy is difficult to form. The current processing methods include composite method, composite diffusion method, ultrasonic casting and hot rolling method, etc., such as the technical solutions disclosed in invention patent applications such as patent application n...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C5/02C22C1/02C21D8/02C22F1/14B21B1/40B23K35/26
Inventor 毛勇宋佳佳郭德燕秦国义
Owner YUNNAN UNIV
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