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Modified adhesive and preparation method for alumina silicate fiber paperboard

A technology of aluminum silicate fiber and adhesive is applied in the field of preparation of aluminum silicate fiber paperboard to achieve the effects of no waste water discharge, low thermal conductivity and easy collapse

Inactive Publication Date: 2013-01-30
QILU UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of poor high temperature resistance of aluminum silicate fiberboard using organic adhesives, high density and easy collapse of inorganic adhesives in the prior art, the present invention provides a A kind of modified adhesive used in aluminum silicate fiber board

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment 1: Preparation of modified adhesive

[0029] Mix disodium hydrogen phosphate, sodium tetraborate and silica sol according to the mass ratio of 1:1:1 to prepare the modifier, mix sodium silicate with the modifier, in order to make the modification effect of the modifier better, For faster performance, the mixture can be stirred at a temperature of 60-80° C. and a stirring speed of 80-120 rpm for 90-180 minutes to prepare a modified adhesive. Different mixing ratios are used to obtain modified adhesives with different modification properties. Since it is impossible to list exhaustively, the following simply lists several modified adhesives with different proportions. 8~12: 1~5

[0030] Sodium silicate and the modifier are mixed according to the mass ratio of 12:1 and heated and stirred to prepare the modified adhesive a;

[0031] Sodium silicate and the modifier are mixed according to the mass ratio of 11:1 and heated and stirred to prepare the modified ad...

Embodiment 2

[0037] Mix the aluminum silicate fiber and the modified adhesive evenly, and the mixing time is about 10 to 30 minutes to obtain the aluminum silicate fiber slurry, which is formed, finished and dried to obtain the aluminum silicate fiber paperboard. The mass ratio of the aluminum silicate fiber to the modified adhesive is (1-2): (8-12).

[0038] The mass ratio of aluminum silicate fiber to modified adhesive is an important factor affecting the final aluminum silicate fiberboard. The following is an example of aluminum silicate fiber with a length ranging from 1.0 to 2.0mm and a diameter ranging from 2 to 6um.

[0039] The modified adhesive a prepared in Example 1 was mixed with aluminum silicate fiber to prepare an aluminum silicate fiber board.

[0040] Among them, the mass ratio of aluminum silicate fiber to modified adhesive is 1:12, 1:9, 1:8, 1:6, 1:4 respectively, and the density of the obtained aluminum silicate fiber board is 298kg / m 3 , 287kg / m 3 , 276kg / m 3 , 265k...

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Abstract

The invention relates to the technical field of an alumina silicate fiber paperboard, in particular to modified adhesive. The raw material of the alumina silicate fiber paperboard comprises sodium silicate and modifying agent, wherein the modifying agent consists of the following components at mass ratio: 1 part of sodium hydrogen phosphate, 1 part of sodium tetraborate and 1 part of silica sol; the mass ratio of the sodium silicate to the modifying agent is (8-12):(1-5). The preparation method for the alumina silicate fiber paperboard comprises the following steps of: adding the alumina silicate fiber into the modified adhesive disclosed in a patent claim 1 or 2 to obtain alumina silicate fiber slurry, wherein the mixing time is 10-30 times; and molding, finishing and drying, wherein the mass ratio of the alumina silicate fiber to the modifying agent is (1-2):(8-12). According to the invention, the alumina silicate fiber paperboard with low density and low thermal conductivity is obtained, the production technology is clean, and no wastewater is discharged.

Description

technical field [0001] The invention relates to the technical field of aluminum silicate fiber paperboard preparation, in particular to a modified adhesive used in the aluminum silicate fiber paperboard, and also to a preparation method of the aluminum silicate fiber paperboard using the modified adhesive. Background technique [0002] Today, with the rapid progress and development of society, energy consumption is increasing day by day, and there is an energy crisis. The main solution to energy problems is to increase revenue and reduce expenditure, and to develop new energy sources, such as: wind power, solar energy, geothermal energy, and tides; throttling means reducing energy. losses and eliminate waste. In the development of new energy technology, energy saving is a major issue related to the survival and development of human beings. Thermal insulation is a technology that is easy to realize and widely used in energy saving technologies. [0003] Aluminum silicate f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B12/04C04B28/26
Inventor 赵传山吴朝军于冬梅李荣刚逄锦江李全鹏
Owner QILU UNIV OF TECH
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