Electric device package
A technology for electrical components and packages, applied in the field of electrical component packages, can solve the problems of thermal damage, burnout, electrode thermal damage, etc. of the organic EL layer, and achieve the effect of ensuring the degree of freedom of design
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Embodiment 1
[0140] First, the first invention will be described in detail based on examples. In addition, the 1st invention is not limited at all by the following Examples. The following examples are merely illustrations.
[0141]
[0142] Table 1 shows the design values of the film structures of Examples (No. 2 to No. 4) of the dielectric multilayer film used in the electric device package of the first invention. In addition, in Table 1, a single-layer dielectric film is shown as a comparative example (No. 1).
[0143] [Table 1]
[0144]
[0145] Although the dielectric multilayer film with the film structure shown in Table 1 is a simulation, it shows Figure 5 The wavelength characteristics of reflectance as shown. As shown in the figure, compared with the example (No. 2) of the 3-layer structure, the wavelength characteristic of the reflectance becomes better as the number of layers increases, and in the example (No. 5) of the 9-layer structure, the maximum reflectance The ...
Embodiment 2
[0147]
[0148] Table 2 shows an example of the film structure of Examples (No. 6 to No. 8) of the dielectric multilayer film used in the electrical component package of the first invention.
[0149] [Table 2]
[0150]
[0151] The frequency characteristic of the reflectivity of this embodiment (No.6~No.8) is as follows Figure 6 shown. The reflectance of the embodiment (No.7) composed of 6 layers and the embodiment (No.8) composed of 8 layers both reached the maximum near the wavelength of 808nm, and in the embodiment (No.8) composed of 8 layers A maximum reflectivity of about 70% is achieved.
Embodiment 3
[0153]
[0154] After printing a paste-like glass frit with a thickness of 15 μm by screen printing on the peripheral portion of a glass substrate with a length of 40 mm x a width of 50 mm x a thickness of 0.5 mm, pre-firing is performed at 500° C. for 1 hour to temporarily cure the glass frit. Fabricate the sealing substrate.
[0155] Here, as the glass frit, a material containing 99% by mass of inorganic powder and 1% by mass of pigment was used. The inorganic powder contained in this glass frit contained 60 vol% of SnO-based glass powder and 40 vol% of refractory filler. SnO-based glass powder contains 59% SnO, 20% P in mole % 2 o 5 , 5% ZnO, 15% B 2 o 3 , 1% Al 2 o 3 Composition as glass. In addition, the average particle size D of the glass powder 50 2.5μm, the largest particle size D max is 7 μm. The refractory filler is composed of zirconium phosphate powder, with an average particle size of D 50 2μm, the largest particle size D max is 8 μm. On the other ...
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