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Metal base plate used for welding power module

A metal substrate and power module technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of power module life reduction, temperature rise, poor welding, etc., to improve service life and reliability, and uniform temperature distribution , The effect of saving manufacturing cost

Active Publication Date: 2015-04-29
MACMIC SCIENCE & TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the power consumption per unit volume of the power semiconductor module increases, it will cause the device to become overheated and fail during operation. Therefore, the heat dissipation technology of the power semiconductor module is the key to the design and use of the power semiconductor module.
[0003] At present, domestic power semiconductor modules use welding methods to weld each chip and each component on the metal substrate. When the chip is soldered, the lower part of the chip is welded to the metal substrate through the solder layer. The uniformity of the thickness of the solder layer cannot be guaranteed. When the solder layer is placed, there will be a certain deviation in its position, so the solder layer will warp and slope to a certain extent, resulting in poor soldering, and poor soldering will lead to an increase in the calorific value during the use of the product, and eventually the temperature will rise. Causes damage to the device, so poor soldering of the chip is one of the factors that cause poor reliability and low life of the semiconductor module
Furthermore, when the power module is used, although the copper substrate is used, due to the different welding positions of each chip, it can only rely on the thermal conductivity of the copper substrate itself for heat conduction. The instantaneous heat conduction effect is not good, which will cause temperature distribution on the copper substrate. Uneven, due to the local temperature rise of the copper substrate, it will eventually lead to a decrease in the life of the power module or failure

Method used

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  • Metal base plate used for welding power module
  • Metal base plate used for welding power module
  • Metal base plate used for welding power module

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Embodiment Construction

[0019] See Figure 1~3 As shown, the metal substrate used for welding power modules of the present invention includes a board body 1, and the board body 1 is provided with mounting holes 4, and the metal substrate is conveniently connected to the shell through fasteners, and the metal substrate is connected to the heat sink. , the heat is forced out through the radiator.

[0020] figure 1 , 2 , 4, the front of the plate body 1 of the metal substrate of the present invention is at least provided with four or more position-limiting protrusions 3 that limit the outer periphery of the solder layer 7, and the height of the position-limiting protrusions 3 on the plate body 1 is greater than that of the solder The height of the layer 7 not only facilitates the placement of the solder sheet, but also limits the solder before and after melting through the limiting protrusion 3 to ensure that the soldering position of the chip 2 remains unchanged. See figure 1 As shown, the limiting...

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Abstract

The invention relates to a metal base plate used for welding a power module, which comprises a plate body, wherein more then four spacing protrusions for spacing the outer periphery of a welding flux layer are arranged on the front face of the plate body, a groove is arranged on the bottom of the plate body, and the groove is filled with a heat conducting silicon grease. In the invention, the metal base plate is improved, so that the metal base plate has reasonable structure, the welding flux layer can be conveniently positioned, the welding reliability is increased, so that the metal base plate has the characteristic of good heat conductivity and can maintain the consistent heat conductivity of the power module and prolong the service life of the power module.

Description

technical field [0001] The invention relates to a metal substrate used for welding power modules, belonging to the technical field of semiconductors. Background technique [0002] With the development of high-power power electronics technology, more and more IGBT power modules are used in the automotive industry, solar energy, wind energy, locomotive traction and other fields. Since the IGBT power modules work under high current and high voltage conditions, the Will generate a lot of power consumption. However, as the power consumption per unit volume of the power semiconductor module increases, it will cause the device to become overheated and fail during operation. Therefore, the heat dissipation technology of the power semiconductor module is the key to the design and use of the power semiconductor module. [0003] At present, domestic power semiconductor modules use welding methods to weld each chip and each component on the metal substrate. When the chip is soldered, t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/13H01L23/373
Inventor 郑军聂世义张敏姚玉双王晓宝
Owner MACMIC SCIENCE & TECHNOLOGY CO LTD
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