Production process of ordinary electric rectifier diode chip
A rectifier diode and production process technology, which is applied in the production process field of ordinary power rectifier diode chips, can solve problems such as acid corrosion, poor thermal fatigue resistance of chips, and single variety, so as to improve the ability of working voltage and solve thermal fatigue problems , The effect of small on-state voltage drop
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[0043] Step 2. After the cutting is completed, the chip is thinned and cleaned to make the surface of the chip clean;
[0044] Step 3, chip press-fit layer structure, please refer to figure 1 As shown, vacuum sintering. After the chip is cleaned, follow the following multi-layer structure from bottom to top: molybdenum sheet 1, aluminum foil 2, single crystal silicon sheet 3, and vacuum sinter in a sintering furnace to form a molybdenum-aluminum-silicon phase alloy on the anode surface. The sintering temperature is between 660°C and 680°C for 30 minutes, vacuum evaporation and vacuum microalloying, the aluminum film 4 is evaporated on the cathode surface of the entire single crystal silicon wafer, and the vacuum microalloying makes the anode surface of the chip form an aluminum-silicon phase alloy , the multi-layer crimping chip structure replaces the traditional welded structure of the ordinary power rectifier chip, and due to the existence of the crimping multi-layer struc...
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