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Light emitting device package and ultraviolet lamp having the same

A light-emitting device packaging and light-emitting diode technology, applied in the field of ultraviolet lamps, can solve problems such as difficulty in providing highly integrated LED packaging, and achieve the effects of inhibiting moisture penetration, improving reliability, and improving heat dissipation efficiency

Active Publication Date: 2012-11-14
SUZHOU LEKIN SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this makes it difficult to provide highly integrated, economical LED packages

Method used

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  • Light emitting device package and ultraviolet lamp having the same
  • Light emitting device package and ultraviolet lamp having the same
  • Light emitting device package and ultraviolet lamp having the same

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0036] Embodiments will now be described in detail with reference to the accompanying drawings in such a manner as to enable those of ordinary skill in the art to easily implement the technical idea of ​​the present disclosure. However, the scope and spirit of the present disclosure are not limited to these embodiments, but can be implemented in various forms.

[0037] In the specification, when it is described that something includes (or includes or has) some elements, it should be understood that it may include (or include or have) only these elements, or, if not specifically limited, it may include (or include or have) have) these elements and others.

[0038] In the drawings, regions irrelevant to the description are omitted for clarity of description, and layers and regions are exaggerated for clarity. Throughout the specification, the same reference numerals refer to the same elements.

[0039] It will be understood that when a layer, film, region or panel is referred ...

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PUM

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Abstract

Provided is a light emitting device package. The light emitting device package comprises a body, a heat diffusing member, a light emitting diode (LED), and a buffer layer. A cavity with an opened topside is formed in the body. The heat dissipation member is disposed between a bottom surface of the cavity and a lower surface of the body. The LED is disposed on one of an electrode disposed on the bottom surface of the cavity. The buffer layer is disposed between the heat dissipation member and a pad and has a thickness thinner than the thickness of the heat dissipation member.The light emitting device package provided in the invention can increase the heat dissipation efficiency.

Description

technical field [0001] The present disclosure relates to a light emitting device package and an ultraviolet lamp having the light emitting device package. Background technique [0002] A light emitting diode (LED) can be used as a light source, and it can be formed of a compound semiconductor material such as a GaAs-containing material, an AlGaAs-containing material, a GaN-containing material, an InGaN-containing material, and an InGaAlP-containing material . [0003] Light emitting device packages capable of emitting light of various colors can be manufactured by packaging these LEDs. The light emitting device package is used as a light source for various devices such as lighting display devices, character display devices, and image display devices. [0004] In particular, ultraviolet (UV) LEDs are capable of emitting light with a wavelength of 245nm to 405nm. For example, short-wavelength light from UV LEDs can be used for sterilization or purification, while long-wavel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/64H01L33/48F21V23/06F21Y101/02
CPCH01L33/642H01L33/48H01L33/62H01L33/64H01L2224/48091H01L25/167H01L33/486H01L2924/00014
Inventor 金炳穆郑粹正金有东李建教
Owner SUZHOU LEKIN SEMICON CO LTD
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