White LED (light-emitting diode) and method for packaging same

A white light and phosphor technology, applied in chemical instruments and methods, luminescent materials, sustainable buildings, etc., can solve the problems of low reliability of white light LEDs, difficult to meet LCD TVs, complicated process steps, etc., reducing the number of chips, connecting The effect of wire reduction, reduction of process steps

Active Publication Date: 2012-11-14
内蒙古华延芯光科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the second method is to coat YAG phosphor (Ce rare earth phosphor) on the blue light chip. Since it is difficult to effectively control the color coordinates and color temperature of a single YAG phosphor, the photoreducibility of the packaged white LED is poor. , it is difficult to meet the requirements of LCD TVs for backlight; and the existing white LEDs used for LCD TV backlights are all packaged with two 20mil*20mil (1mil=0.001inch=0.0254mm) blue chips. The cost of the method is high, the process steps are cumbersome, and the reliability of the packaged white LED is low

Method used

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  • White LED (light-emitting diode) and method for packaging same
  • White LED (light-emitting diode) and method for packaging same
  • White LED (light-emitting diode) and method for packaging same

Examples

Experimental program
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Effect test

Embodiment 1

[0025] Such as figure 1 , figure 2 and image 3 Commonly shown, a white light LED, this white light LED is a SMD5630 lamp tube, including a bracket 1, the upper part of the bracket 1 is provided with a heat dissipation cup 11, the bottom of the heat dissipation cup 11 is provided with 10 and electrodes 6, and the copper block 10 is provided with a heat dissipation cup At the center of the bottom of 11, a blue light chip 2 is provided on the copper block 10, and a wire 7 is connected between the blue light chip 2 and the electrode 6. The wire 7 is a gold wire, and the inside of the cooling cup 11 is coated with fluorescent glue 8, which is Prepared from the following raw materials, TMR-200647-380490 phosphor (Shenzhen Tumeng Electromechanical Technology Co., Ltd.): silicate 05742 phosphor (Intemei Optoelectronics (Shenzhen) Co., Ltd.): silicate, nitride BLT-2500-AB Phosphor powder (Intemei Optoelectronics (Shenzhen) Co., Ltd.): Silica gel 6551AB (Dow Corning 6551 silica gel,...

Embodiment 2

[0037] Such asfigure 1 , figure 2 and image 3 Commonly shown, a white light LED, its structure is basically the same as that of Example 1, the difference is that TMR-200647-380490 fluorescent powder in fluorescent glue 8, silicate 05742 fluorescent powder, silicate, nitride BLT-2500 -The weight ratio of AB phosphor and silica gel 6551AB is: TMR-200647-380490 phosphor: silicate 05742 phosphor: silicate, nitride BLT-2500-AB phosphor: silica gel 6551AB=X:Y:Z :100, where X=0.4, Y=2, Z=5.

Embodiment 3

[0039] Such as figure 1 , figure 2 and image 3 Commonly shown, a white light LED, its structure is basically the same as that of Example 1, the difference is that TMR-200647-380490 fluorescent powder in fluorescent glue 8, silicate 05742 fluorescent powder, silicate, nitride BLT-2500 -The weight ratio of AB phosphor and silica gel 6551AB is: TMR-200647-380490 phosphor: silicate 05742 phosphor: silicate, nitride BLT-2500-AB phosphor: silica gel 6551AB=X:Y:Z :100, where X=0.4, Y=5, Z=2.

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Abstract

A white LED (light-emitting diode) and a method for packaging the white LED relate to the technical field of semiconductor packaging. The white LED comprises a support, wherein a heat dissipating cup is arranged at the upper part of the support; a copper block and an electrode are arranged at the bottom of the heat dissipating cup; a blue light chip is arranged on the copper block; a lead is connected between the blue light chip and the electrode; the heat dissipating cup is internally coated with fluorescence glue which is prepared from the following raw materials: TMR-200647-380490 fluorescent powder, silicate 05742 fluorescent powder, silicate / nitride BLT-2500-AB fluorescent powder and silica gel 6551AB in a ratio of X: Y: Z: 100, wherein X ranges from 0.1 to 1, while Y ranges from 1 to 10 and Z also ranges from 1 to 10. The white LED and the method for packaging the white LED provided by the invention improve the reducibility of light emitted by the white LED and can satisfy the desired backlight of a liquid crystal television, and further are characterized by low production cost and high reliability; therefore, the white LED can be widely applied to the liquid crystal television.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a white light LED and a packaging method thereof. Background technique [0002] LED (Light Emitting Diode) is a semiconductor that can convert electrical energy into light energy. It changes the principle of tungsten filament luminescence of incandescent lamps and three-based toner luminescence of energy-saving lamps, and uses electric field luminescence. The spectrum of white light LEDs is almost all concentrated in the visible light frequency band. Comparing white light LEDs with ordinary incandescent lamps, spiral energy-saving lamps and tricolor fluorescent lamps, the characteristics of LEDs are very obvious: long life, high luminous efficiency, low radiation and low power consumption. It is precisely because of these advantages of LED that white LED lighting has entered a period of rapid development. White light LEDs are usually formed by two methods: one is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50C09K11/02
CPCY02B20/181H01L2224/32245H01L2224/45144H01L2224/48091H01L2224/48247H01L2224/49107H01L2224/73265H01L2224/92247Y02B20/00H01L2924/00014H01L2924/00
Inventor 吉爱华汪英杰王凯敏
Owner 内蒙古华延芯光科技有限公司
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