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Soluble functional polyimide with carbazole structure and preparation method and application thereof

A soluble polyimide and polyimide technology, applied in the field of material science, can solve the problems of single variety and further improvement in performance, and achieve low dielectric constant, excellent thermal stability, and high glass transition temperature. and thermal stability

Active Publication Date: 2014-09-24
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the past two years, soluble functionalized polyimide based on triphenylamine structure has shown attractive application prospects in the application of polymer storage materials due to its unique resistance switching effect, which has aroused the interest of researchers in this field. It is important to note that the focus of this system research is the design and synthesis of diamine monomers containing triphenylamine structure. However, at present, its variety is relatively single, and its performance needs to be further improved. Therefore, it is necessary to carry out the design and synthesis of new functional diamine monomers. Research

Method used

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  • Soluble functional polyimide with carbazole structure and preparation method and application thereof
  • Soluble functional polyimide with carbazole structure and preparation method and application thereof
  • Soluble functional polyimide with carbazole structure and preparation method and application thereof

Examples

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Effect test

Embodiment 1

[0033] At room temperature, 6.2871g (0.01mol) N 1 -(4-(3,6-bis(4-fluorophenyl)-9H-carbazol-9-yl)phenyl)-N 1 -(4-aminophenyl)benzene-1,4-diamine (Kazuo-F) and 67.2ml of N,N-dimethylformamide were added to a 100ml three-neck flask, filled with argon, stirred, and after completely dissolved, added 3.2223g (0.01mol) 3,3',4,4'-Benzophenonetetracarboxylic dianhydride (3,3',4,4'-benzophenonetetracarboxylic dianhydride, BTDA), continue stirring for 12h to obtain a homogeneous viscous polyamic acid solution. Then scrape and coat the polyamic acid solution on the glass plate, then place the glass plate in a vacuum oven and vacuumize it. The heating program is as follows: the room temperature is raised to 100°C and then the temperature is kept constant for 1 hour → 100°C is heated to 200°C and then the temperature is kept constant for the whole process Process 1h→200°C, heat up to 300°C, then keep the temperature constant, the whole process 1h→300°C, heat up to 450°C, keep the temperat...

Embodiment 2

[0036] At room temperature, 6.2871g (0.01mol) N 1 -(4-(3,6-bis(4-fluorophenyl)-9H-carbazol-9-yl)phenyl)-N 1 -(4-aminophenyl)benzene-1,4-diamine (Kazuo-F) and 57.8ml N,N-dimethylformamide were added to a 100ml three-necked flask, filled with argon, stirred, and after completely dissolved, added 2. 9027 g (0.01 mol) of 4,4'-Biphthalic Anhydride (biphenyltetracarboxylic dianhydride, BPDA), continued stirring for 12 hours to obtain a homogeneous viscous polyamic acid solution. Then scrape and coat the polyamic acid solution on the glass plate, then place the glass plate in a vacuum oven, vacuumize, and the heating program is as follows: the temperature is raised from room temperature to 100°C, and then the whole process of constant temperature is 1h → 100°C is heated to 200°C, and then the whole process is constant Process 1h→200°C, heat up to 300°C, then keep the temperature constant, the whole process 1h→300°C, heat up to 450°C, keep the temperature for 1.5h, after cooling, the...

Embodiment 3

[0039] Prepare polyamic acid solution in the same way as in Example 2, and then prepare polyimide by chemical imidization. The steps are as follows: add 5 mL of acetic anhydride to the obtained polyamic acid solution, continue stirring, and then slowly add 2.5 mL of three Ethylamine, and heated to 70°C, continued to stir for 6 hours, then scraped the solution onto a clean glass plate, then placed the glass plate in a vacuum oven, evacuated, and dried at 100°C for 12 hours, and the polyimide film could be taken out after cooling. The infrared spectrogram of this polyimide film is identical with embodiment 2.

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Abstract

The invention discloses a soluble functional polyimide with a carbazole structure and a preparation method and an application thereof. Polyimide materials use an aromatic diamine with a carbazole structure and a large conjugate structure and various tetracid dianhydrides as raw materials, and polyimide materials are prepared through thermal imidization or chemical imidization. As diamine monomers are provided with large non-planar conjugate structures, so that the polyimide is soluble in conventional organic solvents, and is provided with performances of high glass-transition temperature, thermal stability, photoluminescence, electrochromism, low dielectric constant and the like. The synthesis method is simple in process and diversified, and applicable to industrial production. The polyimide can be widely applied in the new and high technology industry field of electronics, microelectronics, information, luminous materials, aerospace and the like.

Description

technical field [0001] The invention relates to the field of material science, in particular to a novel carbazole-containing soluble functional polyimide material and its preparation method and application. technical background [0002] Polyimide is one of the best heat-resistant varieties among engineering plastics that have been industrialized at present. It has outstanding properties unmatched by other materials, such as high mechanical strength, good high and low temperature resistance, excellent dielectric properties, and film-forming properties. OK wait. Since the development and industrialization of DuPont in the United States in the 1960s, it has been applied in various fields, especially in aerospace, aviation, microelectronics and military fields. Since polyimide is generally insoluble in organic solvents, it is usually processed with a precursor polyamic acid with good solubility, and then undergoes dehydration and ring-closing imidization treatment to obtain pol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08C09K11/06
Inventor 张艺刘亦武许家瑞兰麒刘四委池振国
Owner SUN YAT SEN UNIV
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