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Light-emitting diode (LED) lamp module capable of packaging LED chip on radiating supporting carrier circuit and method

A technology of LED chips and LED lamps, which is applied to circuits, components of lighting devices, cooling/heating devices of lighting devices, etc., can solve the problems of long production time, cumbersome production process, slow heat conduction, etc., and achieve simple and efficient manufacturing process. , cheap manufacturing process, low manufacturing cost

Inactive Publication Date: 2012-10-24
王定锋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002]The combination of the traditional three-dimensional heat dissipation support lamp carrier and the circuit board is to make an aluminum-based circuit board or copper-based circuit board, or a ceramic-based circuit board first, through SMT After the components are soldered, paste the back of the circuit board on the three-dimensional heat dissipation support lamp carrier. Due to the long heat transfer distance and the layer-by-layer thermal resistance, this method leads to low heat conduction rate and slow heat conduction, and The production process is quite cumbersome and the production time is long

Method used

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  • Light-emitting diode (LED) lamp module capable of packaging LED chip on radiating supporting carrier circuit and method
  • Light-emitting diode (LED) lamp module capable of packaging LED chip on radiating supporting carrier circuit and method
  • Light-emitting diode (LED) lamp module capable of packaging LED chip on radiating supporting carrier circuit and method

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specific Embodiment

[0038] Next, according to a preferred embodiment of the present invention, adopt COB (Chip On Board) technology to bond the LED chip 4 on the image 3 The three-dimensional heat sink shown is supported on the lamp carrier circuit. An exemplary specific embodiment involved is as follows:

[0039] to clean image 3 The three-dimensional heat dissipation support lamp carrier circuit shown → drip adhesive glue on the three-dimensional heat dissipation support lamp carrier circuit → paste the LED chip 4 and dry it, and then bond the LED chip 4 (such as Figure 4 shown)→Test→Sealing 5 (such as Figure 5 shown)→cure→test→storage, so as to get Figure 5 The shown LED lamp module directly encapsulates the LED chip 4 on the carrier circuit of the three-dimensional heat dissipation supporting lamp.

[0040] in, Figure 4 In order to directly bond the LED chip 4 on image 3 The schematic diagram of the three-dimensional cooling support lamp carrier circuit shown. Figure 5For the L...

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Abstract

The invention relates to an LED lamp module capable of directly packaging an LED chip on a radiating supporting carrier circuit. The LED lamp module comprises a solid radiating supporting lamp carrier circuit and the LED chip, wherein the solid radiating supporting lamp carrier circuit comprises a solid radiating supporting lamp carrier and a circuit which is integrated with the solid radiating supporting lamp carrier, and the LED chip is directly packaged on the solid radiating supporting lamp carrier circuit. The invention also relates to a method for manufacturing the LED lamp module. Compared with traditional LED modules, the LED lamp module capable of directly packaging the LED chip on the solid radiating supporting lamp carrier circuit shortens the heat transfer distance greatly, the heat transfer effect is good, surface mounting technology (SMT) welding is not required to be performed on LEDs and components, the whole manufacturing process is shortened, simultaneously, materials are saved, the manufacturing time is shortened, the production efficiency is greatly improved, and the production cost is reduced.

Description

technical field [0001] The invention belongs to the field of LED application, and in particular relates to an LED lamp module which directly encapsulates an LED chip on a carrier circuit of a three-dimensional heat dissipation supporting lamp. Background technique [0002] The combination of the traditional three-dimensional heat dissipation support lamp carrier and circuit board is to make an aluminum-based circuit board or copper-based circuit board, or a ceramic-based circuit board. After soldering the components through SMT, paste the back of the circuit board on the three-dimensional heat dissipation Supporting the lamp on the carrier, this method has a long heat transfer distance and layers of thermal resistance, resulting in low heat conduction rate, slow heat conduction, and the production process is quite cumbersome and takes a long time to produce. [0003] How to reduce thermal resistance so that the heat generated by LED can be dissipated as soon as possible has ...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V19/00F21V29/00H01L33/48F21Y101/02F21V29/508
Inventor 王定锋徐文红
Owner 王定锋
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