Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Application of organic silicon modifier in modified thermosetting phenolic resin

A technology of silicon modifier and phenolic resin, which is applied in the direction of silicon organic compounds, etc., can solve the problems of uncertain resin structure and molecular weight distribution, unstable product quality, etc., and achieve stable physical and chemical properties, stable product quality, and not easy to absorb water.

Active Publication Date: 2012-09-19
ZHEJIANG UNIV
View PDF3 Cites 18 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The Chinese patent whose publication number is CN 10197420 B uses a kind of organic sericite to modify the thermosetting phenolic resin, which improves the heat resistance of the phenolic resin, but this process is also difficult to carry out the reaction of the organic sericite and the phenolic molecule. Fine control, the structure and molecular weight distribution of the obtained resin are uncertain, and the product quality is unstable

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Application of organic silicon modifier in modified thermosetting phenolic resin
  • Application of organic silicon modifier in modified thermosetting phenolic resin
  • Application of organic silicon modifier in modified thermosetting phenolic resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Add 14.76g of eugenol (164kg, 1000mol) and isopropanol solution of chloroplatinic acid (platinum mass percentage 0.8%) into the synthesis reaction kettle, stir and raise the temperature to about 60°C, and 1,1,3,3-tetramethyl Disiloxane (67kg, 500mol) was added dropwise into the reactor in batches to keep the temperature not higher than 80°C, and the reaction continued for 2 to 3 hours after the end of the heating phenomenon to obtain the organosilicon modifier. Productive rate 93%, the structural formula and nuclear magnetic spectrum of this organosilicon modifier are as figure 1 shown.

[0040]Add 80kg of phenol, 10kg of organic silicon modifier, and 2.7kg of sodium hydroxide into the synthesis reaction kettle, heat up and stir, the temperature rises to about 60°C, add dropwise 100kg of formaldehyde solution with a mass fraction of 37%, and heat up to 80~85°C for reaction after dropping After 130 minutes, neutralize with 5% hydrochloric acid to pH = 7, vacuum dehydrat...

Embodiment 2

[0044] Add 8.77g of eugenol (82kg, 500mol) and isopropanol solution of chloroplatinic acid (platinum mass percentage 0.8%) into the synthesis reaction kettle, stir and heat up to about 60°C, and 1,1,3,3-tetramethyl Disiloxane (33.5kg, 250mol) was added dropwise into the reactor in batches to keep the temperature not higher than 80°C, and the reaction continued for 2 to 3 hours after the end of the heating phenomenon, and then the organosilicon modifier was made , yield 94%.

[0045] Put 100kg of phenol, 10kg of organic silicon modifier, 3.3kg of sodium hydroxide into the synthesis reaction kettle, heat up and stir, the temperature rises to about 60°C, add dropwise 285kg (37wt%) of formaldehyde solution, and raise the temperature to 80~85°C after dropping React for 130 minutes, neutralize with 5% hydrochloric acid to pH = 7, vacuumize and dehydrate under reduced pressure under heating until the temperature is about 90°C, stop heating, add 40kg of ethanol and stir evenly to obta...

Embodiment 3

[0049] Add 14.76 g of 2-allylphenol (133 kg, 1000 mol) and chloroplatinic acid isopropanol solution (platinum mass percentage 0.8%) into the synthesis reactor, stir and heat up to about 60 ° C, and mix 1, 1, 3, 3-Tetramethyldisiloxane (67kg, 500mol) was added dropwise into the reactor in batches to keep the temperature not higher than 80°C, and the reaction continued for 2 to 3 hours after the end of the heating phenomenon to produce 2- Allylphenol type organosilicon modifier, productive rate 91%, the structural formula and nuclear magnetic spectrum of this allylphenol type organosilicon modifier are as figure 2 shown.

[0050] Add 80kg of phenol, 10kg of organic silicon modifier and 2.7kg of sodium hydroxide into the synthesis reaction kettle, heat up and stir, the temperature rises to about 60°C, add dropwise 100kg of formaldehyde solution with a mass percentage content of 37%, keep it for a period of time after dropping, and then Then raise the temperature to 90~95°C and ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses application of an organic silicon modifier in modified thermosetting phenolic resin. The organic silicon modifier is easy to prepare, and a phenolic resin system modified by the organic silicon modifier is high in uniformity and stable in quality. The thermosetting phenolic resin can be prepared from phenol, formaldehyde solution and the organic silicon modifier serving as raw materials by alkali catalytic condensation. The thermosetting phenolic resin is structurally characterized in that polydimethylsiloxane chain segments are chemically bonded to phenolic resin molecules. The prepared modified phenolic resin is difficult to moisturize; the toughness and the heat resistance of the solidified material are excellent; the toughness of a material prepared when the modified phenolic resin is applied to an impregnated material is superior to that of a common phenolic resin product; and the modified phenolic resin can be used as adhesive for preparing composite materials such as high-performance friction materials, and can effectively improve the shearing strength of an adhered position and avoid degumming.

Description

technical field [0001] The invention relates to the field of phenolic resins, in particular to the application of a silicone modifier in modifying thermosetting phenolic resins. Background technique [0002] Phenolic resin is an ancient variety of polymer materials. Its commercial production began in 1905 and has a history of more than 100 years. Because phenolic resin is cheap, easy to prepare, high hardness after curing, and excellent heat resistance, it has been widely used in the fields of foam plastics, coatings and adhesives. Phenolic resins usually include thermoplastic phenolic resin Novolak type, thermosetting phenolic resin Resol type, high ortho phenolic resin and other types. Among them, the thermosetting phenolic resin Resol type is an important type of phenolic resin. This resin has the characteristics of high reactivity and high solid content, and is especially suitable for the preparation of high-performance materials such as phenolic foam plastics, polyuret...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08G8/28C08G8/10C08G77/38C07F7/08
Inventor 范宏李诚卜志扬李伯耿
Owner ZHEJIANG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com