Blind via filling plating method using different current parameter combinations

Abstract

The invention discloses a blind via filling plating method using different current parameter combinations, which belongs to the field of circuit board plating technology. The blind via filling plating method comprises the steps of (1) removing adhesive, chemically depositing copper and flash-plating copper; (2) filling a blind via and plating; (3) drying film. The step (2) specifically includes regulating a plating solution to a solution containing high copper sulfate and low sulfuric acid content; and conducting plating for three periods of time using different current densities, wherein the plating operation is conducted for 30 minutes at the first period of time using a current density of 1.5 to 2.5 A / dm<2>, for 23 to 35 minutes at the second period of time using a current density of 1.2A / dm<2>, and for 10 to 20 minutes at the third period of time using a current density of 1.5 to 2.5A / dm<2>, respectively. The blind via filling plating method provided by the invention has high processing efficiency, low cost, and high processing quality, and is used for plating and blind via filling of circuit boards.

Description

technical field [0001] The invention relates to a method for filling blind holes by electroplating, and more specifically, relates to a method for filling blind holes by electroplating using different current parameter combinations. Background technique [0002] In the production process of the printed circuit board industry, there will be a process that requires electroplating copper to fill blind holes, that is, electroplating blind hole filling technology. The blind holes are ablated by the laser of the laser drilling machine, and are used to realize the conduction and interconnection between the layers of the multilayer board. In the subsequent blind hole filling technology of copper sulfate electroplating on printed circuit boards, high-copper and low-acid potion components are usually used to improve the filling ability of blind holes. In the manufacturing process of electroplating and filling blind holes, there will be the following problems: when using low current p...

AI Technical Summary

Problems solved by technology

In the manufacturing process of electroplating and filling blind holes, there will be the following problems: when using low current production, it takes a long time to fill blind holes, and the production efficiency is relatively low; when using high current production, the uniformity of copper plating Relatively poor, the hole filling effect is not ideal, and it is prone to problems such as voids in the hole, "sealing plating" and too large dimple

[0003] The above problem is a common technical problem in the industry. Most operators adopt low current density and long-time working methods. Disadvantages such as high cost and low efficiency, and the circuit board is soaked in copper sulfate solution for a long time, the board absorbs moisture, and reliability problems such as board explosion are prone to occur during the welding process

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