Chip on board (COB) aluminum substrate with high reflectivity and good heat dissipation performance and manufacturing process thereof

Abstract

The invention provides a chip on board (COB) aluminum substrate with high reflectivity and good heat dissipation performance and a manufacturing process thereof. The manufacturing process comprises the steps that (1) the aluminum substrate is divided into a solid crystal area and a non solid crystal area, wherein a groove is dug in the solid crystal area; (2) the aluminum substrate is fixed by utilizing a fixture, and then copper liquid is poured into the groove; (3) after the copper liquid is solidified to form a copper block, a silver-plated layer is manufactured on the surface of the copper block; (4) an FR-4 composite circuit board is manufactured and then pressed on the aluminum substrate by using a pasting and pressing technology, and the solid crystal area is exposed; (5) an area on the FR-4 composite circuit board, which does not need to be coated, is blocked by utilizing a steel mesh, an area needing to be coated is exposed, the solder preventing white oil is coated on the steel mesh and then dried to form a fen dam, and the solid crystal area is surrounded by the fen dam; and (6) a bowl cup is formed by the fence dam and the solid crystal area, and fluorescent glue is filled into the bowl cup. The aluminum substrate manufactured by adopting the process has the advantages of high reflectivity and good heat dissipation performance, and the manufacturing process is simple.

Description

technical field [0001] The invention relates to the field of LED optoelectronic technology, in particular to a simplified COB aluminum substrate with high reflectivity and good heat dissipation. Background technique [0002] Generally, in the existing substrate design process of MCOB light sources, there are three most commonly used forms: ①, using injection molding to form bowls and cups, the advantage is good consistency, the disadvantage is high price, and the combination of injection molding materials and LED substrates Not good, it is prone to glue leakage, which affects the consistency of light and color; ②, use metal material as the substrate, and use the method of pulling grooves to form bowl cups. The advantage is that the heat conduction effect is good, and the disadvantage is that the price is high, and the gold wire needs to be placed on the bowl Outside the cup, the gold wire is easily damaged when subjected to external force. In addition, when the bowl cup is m...

AI Technical Summary

Problems solved by technology

[0002] Generally, in the existing substrate design process of MCOB light sources, there are three most commonly used forms: ①, using injection molding to form bowls and cups, the advantage is good consistency, the disadvantage is high price, and the combination of injection molding materials and LED substrates Not good, it is prone to glue leakage, which affects the consistency of light and color; ②, use metal material as the substrate, and use the method of pulling grooves to form bowl cups. The advantage is that the heat conduction effect is good, and the disadvantage is that the price is high, and the gold wire needs to be placed on the bowl Outside the cup, the gold wire is easily damaged when subjected to external force. In addition, when the bowl cup is made by the groove method, it is difficult to ensure the flatness of the bottom cup, which affects the consistency of the light emitting direction; ③. The circuit is made on the surface, and the way of cofferdam is used to block the glue. The advantage is that the manufacturing process is simple, and the disadvantage is that the utilization rate of light is low and the thermal resistance is large.

Images