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Colorless and high transparent flexible polyimide film and preparation method thereof

A technology of polyimide film and polyamic acid, which is applied in the field of colorless and highly transparent flexible polyimide film and its preparation, can solve the problems of unknown light transmittance and the like, and achieve high heat resistance and high light transmittance. , the effect of low thermal expansion coefficient

Inactive Publication Date: 2012-07-25
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The patent (CN 101195682A) discloses the use of 4,4'-(4,4'-isopropylidene diphenoxy) bis(phthalic anhydride) as the dianhydride monomer, and the use of 2,2'-diphenoxy (Trifluoromethyl) diaminobiphenyl, 3,3'-diaminodiphenyl sulfone, 3,3'-dimethyl-4,4'-diaminodiphenylmethane three diamine monomers One, but the light transmittance of these polyimide films is unknown, and the UV cut-off wavelength is above 395nm

Method used

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  • Colorless and high transparent flexible polyimide film and preparation method thereof
  • Colorless and high transparent flexible polyimide film and preparation method thereof
  • Colorless and high transparent flexible polyimide film and preparation method thereof

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preparation example Construction

[0032] The above-mentioned colorless highly transparent flexible polyimide film has four different preparation methods, wherein the first method comprises the following steps:

[0033] (2-1) 2,2'-bis(trifluoromethyl)diaminobiphenyl and 4,4'-bis(3-aminophenoxy)diphenylsulfone are dissolved in a polar solvent, wherein 2 , the molar ratio of 2'-bis(trifluoromethyl)diaminobiphenyl and 4,4'-bis(3-aminophenoxy)diphenylsulfone is (1~8):1, add in the solution 4,4'-(hexafluoroisopropylene) diphthalic anhydride, the addition ratio is: 4,4'-(hexafluoroisopropylene) diphthalic anhydride and 2,2'-bis(trifluoromethyl)diaminobiphenyl and 4,4'-bis(3-aminophenoxy)diphenyl sulfone in a ratio of 1:1 to the total moles of diphenyl sulfone, stirred and reacted at room temperature for 24 hours to obtain a polyamic acid solution, and the amount of the above-mentioned polar solvent was based on polyamic acid Solid content 20wt% calculation in the amic acid solution;

[0034] (2-2) Lay the above pol...

Embodiment 1

[0049] Dissolve 5.77g (0.018mol) of 2,2'-bis(trifluoromethyl)diaminobiphenyl and 1.95g (0.005mol) of 4,4'-bis(3-aminophenoxy)diphenylsulfone in After 71g of N-methyl-2-pyrrolidone was completely dissolved, 10.21g (0.023mol) of 4,4'-(hexafluoroisopropene) diphthalic anhydride was added to the above solution at room temperature, and stirred for 12 hours to obtain a solid A polyamic acid solution with a content of 20 wt%. Add 71g of xylene to the polyamic acid solution, stir evenly, raise the temperature to 170°C, keep the reflux reaction for 12 hours, cool down to room temperature after the reaction, pour the solution into 710mL of methanol to settle, and place the precipitate in a vacuum drying oven In drying at 80°C for 12 hours, a white powdery polyimide was obtained. The polyimide powder is dissolved in 71g N-methyl-2-pyrrolidone to obtain a polyimide solution with a solid content of 20wt%, and the polyimide solution is spread on a flat plate, followed by drying at 80°C for...

Embodiment 2

[0052] Dissolve 3.6g (0.011mol) of 2,2'-bis(trifluoromethyl)diaminobiphenyl and 4.86g (0.011mol) of 4,4'-bis(3-aminophenoxy)diphenylsulfone in In 73g of γ-butyrolactone, after being completely dissolved, add 9.77g (0.022mol) 4,4'-(hexafluoroisopropene) diphthalic anhydride to the above solution at room temperature, and stir for 12 hours to obtain a solid content of 20wt % polyamic acid solution. Add 73g of xylene to the polyamic acid solution, stir evenly, raise the temperature to 170°C, keep the reflux reaction for 12 hours, cool down to room temperature after the reaction, pour the solution into 730mL of methanol to settle, and place the precipitate in a vacuum drying oven In drying at 80°C for 12 hours, a white powdery polyimide was obtained. The polyimide powder is dissolved in 73g gamma-butyrolactone to obtain a polyimide solution with a solid content of 20wt%, and the polyimide solution is spread on a flat plate, followed by drying at 80°C for 2 hours, and then drying a...

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Abstract

The invention relates to a colorless and high transparent flexible polyimide film, belonging to the technical field of polymer materials, wherein the colorless and high transparent flexible polyimide film is prepared by the following steps of dissolving 2,2'-bis(trifluoromethyl) diamino biphenyl and 4,4'-bis(3-aminophenoxy)-diphenyl sulfone in a polar solvent, adding 4,4'-(hexafluoroisopropylidene) diphthalic anhydride into the solution, stirring for 24 hours at room temperature to obtain a polyamide acid solution, spreading the solution on a plate to form a film, drying, curing and strippingthe film in water. Polyimide provided by the invention has high molecular weight and high solubility; the polyimide film provided by the invention has the advantages of high transparency, high heat resistance, low thermal expansion and low-temperature curing capability and is suitable for flexible displays, optical device protective films and substrate materials of transparent conductive films.

Description

technical field [0001] The invention relates to a colorless and highly transparent flexible polyimide film and a preparation method thereof, belonging to the technical field of polymer materials. Background technique [0002] Polyimide has excellent mechanical properties, heat resistance, low temperature resistance, flame retardancy, solvent resistance and electrical properties, and can be used as structural composite materials, electrical insulation materials, adhesives and coating materials, and is widely used in electronic micro Electronics, aerospace, optics, electromechanical and other fields. Especially in the field of microelectronics, polyimide is often used as a dielectric layer for interlayer insulation, as a buffer layer to reduce stress, as a protective layer to reduce environmental damage, and as a shielding layer to reduce device errors. Used in various electronic components such as substrates of flexible printed wiring circuits and alignment films for liquid ...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08G73/10C08J5/18
Inventor 王晓工王兴元和亚宁金成九
Owner TSINGHUA UNIV
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