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Vapor chamber having support posts with inner-sintering structure

A technology of structural support and vapor chamber, applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating transformation, etc., can solve the problem of enhanced boiling structure damage of the lower cover plate, affecting the heat transfer performance of the vapor chamber, etc. problem, to achieve the effect of simple and easy technical means, easy popularization and application, and good temperature uniformity

Active Publication Date: 2014-12-31
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after adding supporting copper pillars in an array, the enhanced boiling structure of the lower cover is damaged, which affects the heat transfer performance of the vapor chamber to a certain extent

Method used

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  • Vapor chamber having support posts with inner-sintering structure
  • Vapor chamber having support posts with inner-sintering structure
  • Vapor chamber having support posts with inner-sintering structure

Examples

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Embodiment Construction

[0025] The specific embodiments of the present invention will be described in further detail below, but the embodiments of the present invention are not limited thereto.

[0026] like figure 1 As shown, the soaking plate with inner sintering structure support columns of the present invention includes an upper cover plate 1 and a lower cover plate 4, a cavity is formed between the upper cover plate 1 and the lower cover plate 4, and the surrounding area is sealed to form a soaking plate. The inside of the vapor chamber is filled with a heat transfer liquid working medium, and the upper cover plate 1 and the lower cover plate 4 are provided with a sintered capillary core 2 and a sintered capillary core 3 in the cavity between the upper cover plate 1 and the lower cover plate 4. The inner bottom surface of the cover plate 4 is distributed with a plurality of support columns 6 and a plurality of stress-absorbing rings 5 ​​with a concave structure. The sintered capillary core 2 of ...

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PUM

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Abstract

The invention discloses a vapor chamber having support posts with an inner-sintering structure. The vapor chamber is characterized in that: upper cover plate sintering capillary wicks and lower cover plate sintering capillary wicks are arranged in a cavity between an upper cover plate and a lower cover plate, a plurality of support posts and a plurality of stress absorption rings having a sinking structure are distributed at the inner bottom of the lower cover plate, the upper cover plate sintering capillary wicks and the lower cover plate sintering capillary wicks are provided with a plurality of mounting holes through which the support posts penetrate; and a plurality of bosses which are naturally formed during sintering, and correspondingly matched with sinking positions of the stress absorption rings are distributed on the lower surface of the lower cover plate sintering capillary wicks. The vapor chamber has the advantages that: the stress absorption rings of the vapor chamber can effectively absorb deformation; the regional support post distribution eliminates the influence of the support posts on the enhanced boiling structure of the lower cover plate; capillary porosity wicks in the support posts shorten the refluxing path of liquid working medium in condensing section, separate raising vapor generated by enhanced boiling and reflux falling liquid working medium in the vapor chamber, avoid a shearing effect generated by the contact between a vapor interface and a liquid working medium interface and improve heat-transfer capability.

Description

technical field [0001] The invention relates to a soaking plate for heat dissipation of electronic components, in particular to a soaking plate with an inner sintered structure support column. Background technique [0002] As the degree of circuit integration becomes higher and higher, the packaging density and operating frequency continue to increase, which increases the heat generated by electronic components per unit volume and the energy consumption of a single chip, and the design of the compact structure of the equipment makes heat dissipation more difficult. There is an urgent need to solve the technical problem of high-efficiency heat dissipation. Traditional cooling methods such as natural air convection, air forced convection, and liquid natural convection have been difficult to meet the needs of further development in the electronics field; special cooling methods such as liquid forced convection and gas / liquid phase change have become the current and future trend...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20F28D15/04
Inventor 陆龙生刘晓辰廖火生谢颖熙刘小康
Owner SOUTH CHINA UNIV OF TECH
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