Heat radiation plate, semiconductor device and manufacturing method of heat radiation plate
A manufacturing method and heat dissipation plate technology, which are applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as reduced jointability, cracks, and inability to bond semiconductor elements well, and achieve improved The effect of bonding reliability
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[0057] Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0058] First, refer to Figure 1 to Figure 4 , a power module (semiconductor device) using the heat sink according to the first embodiment of the present invention will be described.
[0059] figure 1 The illustrated power module 1 includes a power module substrate 10, and on one side of the power module substrate 10 (in figure 1 The upper side in the center) the semiconductor chip 3 bonded by the solder layer 2 is arranged on the other side of the power module substrate 10 (on the figure 1 The center is the lower side) of the heat sink 30 and the cooler 40 arranged on the other side of the heat sink.
[0060] The power module substrate 10 includes a ceramic substrate 11, and is disposed on one side of the ceramic substrate 11 (in figure 1 The circuit layer 12 on the top) and the other side of the ceramic substrate 11 (in the figure 1 The middle is the metal layer ...
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