Cleaning method of solar battery silicon chip

Abstract

The invention provides a cleaning method of a solar battery silicon chip, which comprises the following steps of: cleaning the solar battery silicon chip by adopting alcohol or terpineol to obtain the preliminarily-cleaned solar battery silicon chip; cleaning the preliminarily-cleaned solar battery silicon chip by adopting alkaline cleaner solution to obtain the alkaline-cleaned solar battery silicon chip; cleaning the alkaline-cleaned solar battery silicon chip by adopting water; cleaning the water-cleaned solar battery silicon chip by adopting hydrogen peroxide solution; and cleaning the hydrogen peroxide solution-cleaned solar battery silicon chip by adopting water to obtain the solar battery silicon chip which is more cleanly cleaned. The cleaning method of the solar battery silicon chip has the beneficial effect that metal powder and an organic solvent remaining on the surface of the solar battery silicon chip are respectively removed by the alkaline cleaner solution and the hydrogen peroxide solution, so that the metal powder and the organic solvent remaining on the surface of the solar battery silicon chip are reduced, and the reutilization rate of the solar battery silicon chip with unqualified printing paste is improved.

Description

technical field [0001] The invention relates to the technical field of silicon wafer cleaning in the production process of solar cells, and more specifically relates to a method for cleaning silicon wafers of solar cells. Background technique [0002] A solar cell is a device that directly converts light energy into electrical energy through the photoelectric effect. The main technological process for manufacturing solar cells is: texturing, diffusion, peripheral etching, PECVD (Plasma Enhanced Chemical Vapor Deposition, Plasma Enhanced Chemical Vapor Deposition) and printing and sintering. [0003] In the printing and sintering process, the paste is printed on the front and back of the silicon wafer, and after sintering, electrodes are formed to collect charges and facilitate the soldering of components. [0004] Paste refers to the composition of silver powder, aluminum powder and inorganic binder glass frit, organic vehicle and other additives, wherein the organic vehicl...

AI Technical Summary

Problems solved by technology

However, the metal powder and organic solvent contained in the slurry cannot be dissolved in alcohol, and will adhere to the surface of the silicon wafer, resulting in that the alcohol cannot be completely wiped clean.

Silicon wafers that have not been wiped clean, that is, silicon wafers with metal powder and organic solvents attached to the surface, are put into production. After texturing, there will be a large number of unqualified silicon wafers, which seriously affects the pass rate of finished products, and eventually leads to unqualified printing paste. of silicon wafers have a low reuse rate

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