Method for preparing graphene on 3C-SiC substrate
A graphene and 3c-sic technology, applied in the field of microelectronics, can solve the problems of expensive single crystal SiC, difficulty in manufacturing graphene, uneven layers, etc., and achieve the effect of low porosity, smooth surface and low price
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Embodiment 1
[0023] Step 1: Remove sample surface contamination.
[0024] Clean the surface of the 4-inch Si substrate substrate, that is, use NH 4 OH+H 2 o 2 Soak the sample in the reagent for 10 minutes, take it out and dry it to remove the organic residue on the surface of the sample; then use HCl+H 2 o 2 The reagent soaked the sample for 10 minutes, took it out and dried it to remove ionic contamination.
[0025] Step 2: Put the Si substrate substrate into the reaction chamber of the CVD system, and evacuate the reaction chamber to 10 -7 mbar level.
[0026] Step 3: growing the carbonized layer.
[0027] Under the condition of H2 protection, the temperature of the reaction chamber is raised to the carbonization temperature of 950°C, and then the flow rate of 30ml / min C 3 h 8 , grow a layer of carbonized layer on the Si substrate, the growth time is 7min.
[0028] Step 4: growing a 3C-SiC epitaxial film on the carbonized layer.
[0029] Rapidly raise the temperature of the rea...
Embodiment 2
[0041] Step 1: Remove sample surface pollutants.
[0042] Clean the surface of the 8-inch Si substrate substrate, that is, use NH 4 OH+H 2 o 2 Soak the sample in the reagent for 10 minutes, take it out and dry it to remove the organic residue on the surface of the sample; then use HCl+H 2 o 2 The reagent soaked the sample for 10 minutes, took it out and dried it to remove ionic contamination.
[0043] Step 2: Put the Si substrate substrate into the reaction chamber of the CVD system, and evacuate the reaction chamber to 10 -7 mbar level.
[0044] Step 3: growing a carbonized layer.
[0045] in H 2 In the case of protection, the temperature of the reaction chamber is raised to the carbonization temperature of 1050 ° C, and then the flow rate of 30ml / min is introduced into the reaction chamber. 3 h8 , grow a layer of carbonized layer on the Si substrate, the growth time is 5min.
[0046] Step 4: growing a 3C-SiC epitaxial film on the carbonized layer.
[0047] Rapidly ...
Embodiment 3
[0055] Step A: Clean the surface of the 12-inch Si substrate, that is, use NH 4 OH+H 2 o 2 Soak the sample in the reagent for 10 minutes, take it out and dry it to remove the organic residue on the surface of the sample; then use HCl+H 2 o 2 The reagent soaked the sample for 10 minutes, took it out and dried it to remove ionic contamination.
[0056] Step B: Put the Si substrate substrate into the reaction chamber of the CVD system, and vacuumize the reaction chamber to 10 -7 mbar level.
[0057] Step C: In H 2 In the case of protection, the temperature of the reaction chamber is raised to the carbonization temperature of 1150 ° C, and then the flow rate of 30ml / min is introduced into the reaction chamber. 3 h 8 , for 3 min to grow a carbonized layer on the Si substrate.
[0058] Step D: Rapidly raise the temperature of the reaction chamber to the growth temperature of 1300°C, and feed the SiH with flow rates of 25ml / min and 50ml / min respectively. 4 and C 3 h 8 , to...
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