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Method for producing asymmetrically laminated printed circuit board

A printed circuit board, asymmetric technology, applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems of different layer thicknesses or copper foil thicknesses on both sides, product quality problems, and increased scrap volume. Leveling steps, the effect of reducing the difficulty of production

Inactive Publication Date: 2012-07-04
苏州艾迪亚电子科技有限公司
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Problems solved by technology

[0004] The present invention provides a method for producing asymmetrically laminated printed circuit boards, aiming to solve the process of processing printed circuit boards provided by the prior art, which easily leads to different and asymmetric thicknesses of layers on both sides or thickness of copper foil , the surface of the board will be warped towards the thinner side during the production process after lamination, and it can only be leveled after forming, which will lead to unexpected things in subsequent processing, which will bring serious quality problems to the product. The problem of rising costs due to the increase in scrap

Method used

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  • Method for producing asymmetrically laminated printed circuit board
  • Method for producing asymmetrically laminated printed circuit board

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Embodiment Construction

[0012] In order to make the purpose, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the invention.

[0013] figure 1 The implementation flow of the method for producing an asymmetrical laminated printed circuit board provided by the embodiment of the present invention is shown.

[0014] The method includes the following steps:

[0015] In step S101, preliminary processing is performed on the plate for producing printed circuit boards;

[0016] In step S102, hot pressing is performed on the preliminarily treated plate;

[0017] In step S103, cold press treatment is performed on the plate that has undergone hot press treatment;

[0018] In step S104, subsequent operations and processing are performe...

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Abstract

The invention belongs to the field of printed circuit boards, and provides a method for producing an asymmetrically laminated printed circuit board. Hot pressing treatment is performed on boards in six stages by modifying lamination parameters, pressure, temperature and time are rationally controlled according to production requirements, and the boards are gradually and uniformly heated and pressurized in stages, so that a manufacturing process for the printed circuit board is optimized. A layer of core board is sandwiched between the boards, so that the hardness of the boards is improved, the boards are difficult to bend and deform, the problem that the board is warped towards a thin surface in the production of a subsequent procedure after the lamination is effectively solved, the production difficulty of the subsequent procedure is reduced, a leveling step after forming is avoided, production cost is decreased, and production efficiency is improved.

Description

technical field [0001] The invention belongs to the field of printed circuit boards, and in particular relates to a method for producing asymmetrically pressed printed circuit boards. Background technique [0002] Printed circuit board is a kind of product that uses complex processing procedures to supplement wires on copper plates, and is manufactured through a series of processes such as etching, and provides carrier boards for subsequent placement products. The main products are used in all consumer appliances, Industrial control, communication, wireless communication and other fields. [0003] The process of processing printed circuit boards provided by the prior art can easily lead to different and asymmetric thicknesses of the layers on both sides or the thickness of the copper foil, and the board surface will warp to the thinner side during production after lamination, and it can only be trimmed after forming. This will lead to unexpected things in the subsequent pro...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
Inventor 沙磊吴永青胡建明赵永刚周青锋
Owner 苏州艾迪亚电子科技有限公司
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