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Epoxy modified polyphenylene ether resin, resin composition and its application

A technology of polyphenylene ether resin and resin composition, which is applied in circuit substrate materials, printed circuits, electrical components, etc., can solve problems such as damage to operators and increase environmental protection investment of polyphenylene ether resin, so as to reduce environmental protection investment and avoid possible problems. damage effect

Active Publication Date: 2014-03-12
ELITE ELECTRONICS MATERIAL ZHONGSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be clearly known with reference to its preparation method that environmentally harmful halides such as bromide and chloride will be produced in the process of the polyphenylene ether resin (that is, its leaving group is a halide), thus increasing the polyphenylene ether The environmental protection investment of the resin manufacturing process may cause damage to the corresponding operators

Method used

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  • Epoxy modified polyphenylene ether resin, resin composition and its application
  • Epoxy modified polyphenylene ether resin, resin composition and its application
  • Epoxy modified polyphenylene ether resin, resin composition and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] (1) Preparation of epoxy-modified polyphenylene ether resin prepolymer solution:

[0062] Add 100 parts by weight of PPO solid polyphenylene ether resin (MX-90 SABIC Innovative Plastics), into a methyl ethyl ketone solvent, dissolve into a liquid polyphenylene ether resin solution, and then add 24 parts by weight of bisphenol A type epoxy The resin and 0.05 parts by weight of 2-methylimidazole (2-methylimidazole, 2-MI) are added to the methyl ethyl ketone solution, and stirred and mixed at 120° C. for 1 to 3 hours to obtain a solution.

[0063] (2) Preparation of epoxy-modified polyphenylene ether resin composition

[0064] Step (1) epoxy modified polyphenylene ether resin prepolymer of 124 parts by weight, bisphenol A novolac epoxy resin of 100 parts by weight, phenol novolac resin of 30 parts by weight, 2-MI of 0.1 parts by weight, 100 parts by weight of fused silica, 20 parts by weight of phosphorus-containing flame retardant (PX-200, Japan Daihachi Chemical Co., Lt...

Embodiment 2

[0068] (1) Preparation of epoxy-modified polyphenylene ether resin prepolymer solution:

[0069] Add 100 parts by weight of PPO solid polyphenylene ether resin (MX-90 SABIC Innovative Plastics) into a methyl ethyl ketone solvent to dissolve into a liquid polyphenylene ether resin solution, and then add 35 parts by weight of dicyclopentadiene type Epoxy resin and 0.05 parts by weight of 2-MI were added to the butanone solution, stirred and mixed at 120° C. for 1 to 3 hours to obtain a prepolymer solution.

[0070] (2) Preparation of Epoxy Modified Polyphenylene Ether Resin Composition

[0071] Step (1) epoxy modified polyphenylene ether resin prepolymer of 135 parts by weight, bisphenol A novolak epoxy resin of 100 parts by weight, phenol novolac resin of 30 parts by weight, 2-MI of 0.1 parts by weight, 100 parts by weight of fused silica, 20 parts by weight of phosphorus-containing flame retardant (PX-200, Japan Daihachi Chemical Co., Ltd.) and 30 parts by weight of propylene...

Embodiment 3

[0075](1) Preparation of epoxy-modified polyphenylene ether resin prepolymer solution:

[0076] Add 100 parts by weight of PPO solid polyphenylene ether resin (MX-90 SABIC Innovative Plastics), into a methyl ethyl ketone solvent, dissolve into a liquid polyphenylene ether resin solution, and then add 33 parts by weight of biphenyl aralkyl Novolac epoxy resin and 0.05 parts by weight of 2-MI were added to the methyl ethyl ketone solution, and stirred and mixed at 120° C. for 1 to 3 hours to obtain a prepolymer solution.

[0077] (2) Preparation of Epoxy Modified Polyphenylene Ether Resin Composition

[0078] Step (1) epoxy modified polyphenylene ether resin prepolymer of 133 parts by weight, bisphenol A novolak epoxy resin of 100 parts by weight, phenol novolac resin of 30 parts by weight, 2-MI of 0.1 parts by weight, 100 parts by weight of fused silica, 20 parts by weight of phosphorus-containing flame retardant (PX-200, Japan Daihachi Chemical Co., Ltd.) and 30 parts by weig...

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Abstract

Disclosed is an epoxy-modified polyphenylene oxide resin. The epoxy-modified polyphenylene oxide resin has a structural unit as shown in formula (I), and which is produced by the following steps: adding polymerization reaction solvent to 100 parts of solid polyphenylene oxide resin for forming a liquid polyphenylene oxide resin solution, and then adding 5-60 parts of epoxy resin and 0.001-5 parts of a catalyst to the solution, stirring and mixing at the temperature of 80-140°C for 1-3 hours to obtain a prepolymerization solution. Further disclosed are a resin composition containing the epoxy-modified polyphenylene oxide resin and an application for preparing printed circuit board. The epoxy-modified polyphenylene oxide resin composition has excellent impregnation properties for glass fiber cloth, the preparation process of which is simple, highly efficient and environmentally friendly, and the product purity of which is highly controllable. The epoxy-modified polyphenylene oxide resin composition can be used for making a laminated material and a copper clad laminated plate, which has excellent heat resistance and dielectric properties and is in favor of signal transmission of high frequency circuit board.

Description

technical field [0001] The invention relates to an electronic material, in particular to an epoxy-modified polyphenylene ether resin, a resin composition containing the epoxy-modified polyphenylene ether resin and their application in preparing printed circuit boards. Background technique [0002] Copper foil laminate is an important manufacturing raw material for printed circuit boards. In the prior art, the manufacturing method of the copper foil laminate is to impregnate the resin composition suitable for the printed circuit board on the glass fiber cloth, and then form the prepreg after baking, and then make the upper and lower parts of the prepreg After the two layers of copper foil are laminated, they are pressed into a copper foil laminate by vacuum, heat and pressure, etc., and the prepreg is cured to form the insulating layer of the copper foil laminate. [0003] In order to improve the dielectric properties of the insulating layer of copper foil laminates, such as...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G65/48C08G81/00C08L71/08C08L87/00C08L63/00C08K7/14C08J5/04B32B15/08H05K1/03
CPCH05K1/0326H05K2201/029H05K1/0366C08L71/08H05K1/03C08G65/48B32B15/08C08L87/00C08L63/00C08G81/00C08L71/12C08G65/485C08L2205/05
Inventor 李长元
Owner ELITE ELECTRONICS MATERIAL ZHONGSHAN
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