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Wafer chamfering machine and wafer machining method

A technology of chamfering machine and wafer, which is applied in the direction of metal processing equipment, manufacturing tools, grinding machine parts, etc., can solve the problems of high precision chamfering size, low manual processing precision, high labor cost, etc., to achieve High processing precision, improve the utilization rate of machinery, and avoid the effect of duplication of labor force

Inactive Publication Date: 2012-06-20
杨心宏
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Problems solved by technology

The wire cutting material of the LED substrate sheet itself is a thin sheet with a thickness of about 0.5MM. Wafer chamfering processing is one of the important steps. The chamfering dimension precision is high, and the manual processing accuracy is low. Manual vibration will cause the chamfering to break, Chipping, different sizes, etc., high labor costs, low efficiency, and low yield

Method used

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  • Wafer chamfering machine and wafer machining method
  • Wafer chamfering machine and wafer machining method
  • Wafer chamfering machine and wafer machining method

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Embodiment Construction

[0022] The present invention will be described in detail below in conjunction with the accompanying drawings. As a part of this specification, the principle of the present invention will be described through embodiments. Other aspects, features and advantages of the present invention will become clear at a glance through the detailed description.

[0023] A wafer chamfering machine, including a frame 6, a data processing system and a numerical control device for processing wafers 3; the numerical control device includes a chamfering working end 1; the data processing system includes a data input unit, a data processing unit and Data output unit; the data output unit is connected with the numerical control device for inputting data to the numerical control device; the numerical control device is used to control the chamfering working end 1 to chamfer the wafer 3 .

[0024] The wafer chamfering machine adopts natural granite base, gantry frame, durable, no deformation, no vibrati...

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Abstract

The invention discloses a wafer chamfering machine, which comprises a frame, a data processing system and a numerical control device for wafer machining. The numerical control device comprises a chamfering operation end, the data processing system comprises a data input unit, a data processing unit and a data output unit, the data output unit is connected with the numerical control device and used for inputting data to the numerical control device, and the numerical control device is used for controlling the chamfering operation end to chamfer wafers. The wafer processing method includes that wafer information is input in the data processing system and outputted to a command receiving end of the numerical control device after data processing, an executive optical device automatically searches the wafer to lead the operation end to focus on the edge of the wafer, the wafer is circumferentially machined by the operation end until chamfering is complete, and a wafer program is reloaded for machining of a next wafer and quitted until the procedure is complete. The wafer data are stored for calling of the next time. The wafer chamfering machine and the wafer machining method are high in machining precision and high in yield.

Description

technical field [0001] The invention relates to the mechanical field, in particular to a wafer chamfering machine and a wafer processing method thereof. Background technique [0002] In the process of LED (light-emitting diode) wafer lens processing, the bar material is first cut into thin slices by multi-wire cutting, and then it is ground and polished to make LED substrates (epitaxial wafers) before grinding and polishing. Chamfering to achieve the basic conditions of grinding and polishing. The processed wafer (LED substrate sheet) is processed to form a sharp edge. It cannot be directly ground and polished, and must be chamfered. The wire cutting material of the LED substrate sheet itself is a thin sheet with a thickness of about 0.5MM. Wafer chamfering processing is one of the important steps. The chamfering dimension precision is high, and the manual processing accuracy is low. Manual vibration will cause the chamfering to break, Chipping, different sizes, etc., high...

Claims

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Application Information

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IPC IPC(8): B24B9/06B24B51/00
Inventor 杨心宏
Owner 杨心宏
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