Wheat flour milling wheat treating workshop process only stripping pericarp and complete equipment

Abstract

The invention belongs to the technical field of wheat processing, in particular to a wheat flour milling wheat treating workshop process only stripping pericarp and complete equipment. The wheat flour milling wheat treating workshop process comprises four working sections including dirty wheat clearing, peeling, cleaned wheat clearing and modifying. The peeling working section is composed of the processes of water addition and stirring. Most of pericarp is peeled in a wheat treating workshop, seed coat is substantially not damaged, the probability that the seed coat is ground into tiny wheat bran to be mixed into flour is greatly reduced, and ash content of the flour generated by a production line is reduced by over 0.02%. A wheat treating workshop wheat washer is omitted, water resources are saved, water pollution caused by the wheat washer is solved, and the economic and social benefits are huge.

Description

Technical field [0001] The invention belongs to the technical field of wheat processing, and specifically relates to a wheat flour milling room technology and complete sets of equipment that only peel off the peel. Background technique [0002] Wheat milling technology includes two parts: wheat cleaning and wheat milling. In the wheat flour production line, the wheat cleaning workshop is referred to as the wheat room, and the wheat flour workshop is referred to as the flour room. The prior art wheat room process includes primary cleaning (referring to the preliminary cleaning of raw grains before entering the warehouse), wool wheat (wheat after primary cleaning or raw grains without primary cleaning section) cleaning, tempering treatment, and light wheat (after cleaning the raw grains) Of wheat) 5 stages of cleaning and peeling. Wheat cleaning usually consists of air separation (common equipment is vertical suction duct, suction separator and circulating air dust collector, etc...

AI Technical Summary

Problems solved by technology

But because of the thick wheat cortex, the high strength, the binding force between the seed coat and the endosperm is very strong, and the wheat grain has a ventral groove whose deep surface area accounts for about 1 / 3 of the total surface area of ​​the wheat grain. Equipment similar to the rice mill can only peel off 30% to 60% of the cortex of the wheat grains after adding water properly and moistening the wheat for more than 20 hours, and the broken grain rate reaches 1% to 3%.

Especially after the peeling, the thinned or torn wheat husks left on the milled grains will be ground into fine bran stars during the repeated grinding and milling process in the flour room, and the probability of being mixed into the flour is higher than that of the unpeeled ones. As a result, although the ash content of the milled wheat is significantly reduced, the ash content of the output flour is not significantly reduced or even rises instead of falling.

At the same time, the existing wheat peeling and milling technology also has shortcomings such as high energy consumption and exposed endosperm after peeling, which leads to arching in the wheat barn and affects production, so it is rarely used now.

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