Gravity compensation device

Abstract

The invention discloses a gravity compensation device which is used for supporting a micropositioner of a worktable and a reticle stage in a photoetching machine and is communicated with a gas circuit of a gas supplying gas source. The gravity compensation device comprises a first gas chamber, a piston, a supporting plate and a pneumatic valve, wherein the piston is supported by the first gas chamber; the supporting plate is used for supporting the micropositioner, is positioned above the piston and is fixedly connected with the piston; and the valve is communicated with the first gas chamber and is used for adjusting the air pressure of the first air chamber. The gravity compensation device has the advantages that: firstly, the gravity compensation device has a simple structure; secondly, the gravity compensation device has lower rigidity so as to isolate low-frequency vibration; thirdly, the gravity compensation device has certain damping so as to reduce resonance; thirdly, the gravity compensation device has no action of exhausting gas to the environment and can be applied to a vacuum environment; and fourthly, when a load changes, the error of a static position of the reticle stage can be eliminated by adjusting the air pressure of the first gas chamber.

Description

technical field [0001] The invention relates to an integrated circuit manufacturing process equipment, in particular to a gravity compensation device. Background technique [0002] In the front-end manufacturing of large-scale semiconductor integrated circuits, photolithography is a very important process. It is a complex process that sequentially transfers chip patterns on a series of masks to corresponding layers of the wafer through an exposure system. The entire photolithography process consumes about 60% of the chip front-end manufacturing time, and accounts for nearly 40% of the cost of the entire chip manufacturing. This series of complex, expensive, and time-consuming lithography processes is concentrated on a group of lithography machines corresponding to the chip front-end production line, and the lithography machines are also the most complex and demanding equipment in the front-end manufacturing of semiconductor integrated circuits , the lithography machine inte...

AI Technical Summary

Problems solved by technology

[0005] In the U.S. Patent No. US20050036126, a micro-motion table supported by steel springs is disclosed. The micro-motion table described in this patent has the following disadvantages: 1. The quality of the micro-motion table changes, causing the rigid spring to produce static Position offset; 2. In order to maintain the position stability of the micro-motion table, the steel spring has a relatively high stiffness, and the vibration of the base is easily transmitted to the micro-motion table; 3. The steel spring has no damping and is easy to excite resonance

[0006] In the U.S. Patent No. US6473161, a micro-movement table supported by air flotation is disclosed. There are several disadvantages in this patent: 1. The design of the air flotation structure is very complicated; 2. The structure will discharge gas to the environment. It cannot be applied in a vacuum environment; 3. The air flotation structure is very sensitive to the particle pollution of the gas, and a particle filter device is required to eliminate the particle pollution, which increases the cost of use; 4. The processing of the internal pipes and small holes of the air flotation structure is complicated and the cost is relatively high. high

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