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Light-reflective anisotropic electroconductive adhesive agent and light-emitting device

一种导电粘接剂、光反射性的技术，应用在导电粘合剂、胶粘剂、导电材料等方向，能够解决LED元件33发光效率降低等问题，达到波长依赖小、波长依赖性小、提高发光效率的效果

Inactive Publication Date: 2012-05-30
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But when Figure 4 In the case of a light-emitting device, among the light emitted by the LED element 33, the light with a wavelength of 400 to 500 nm emitted to the upper surface side is absorbed by the gold wire 37, and part of the light emitted to the lower surface is absorbed by the die-bonding adhesive. 32 absorption, there is a problem that the luminous efficiency of the LED element 33 decreases

Method used

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  • Light-reflective anisotropic electroconductive adhesive agent and light-emitting device
  • Light-reflective anisotropic electroconductive adhesive agent and light-emitting device
  • Light-reflective anisotropic electroconductive adhesive agent and light-emitting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] The following two substances are uniformly mixed into a colorless and transparent thermosetting epoxy-based adhesive composition with a refractive index of about 1.50 (YX-8000, JER Co., Ltd.: 50% by mass of MeHHPA): 12% by volume Titanium dioxide powder (KR-380, Chitan Industries Co., Ltd.) with an average particle size of 0.5 μm as light-reflective insulating particles and 10% by mass of Au-coated resin conductive particles with an average particle size of 5 μm as conductive particles (Spherical acrylic resin particles with an average particle diameter of 4.6 μm were subjected to electroless gold plating with a thickness of 0.2 μm (Braite 20GNB4.6EH, Nippon Chemical Industry Co., Ltd.), thereby obtaining a light-reflective each with a white appearance color. Anisotropic conductive adhesive.

[0069] (Light reflectance evaluation test)

[0070] The obtained light-reflective anisotropic conductive adhesive was applied to a ceramic white board so that the dry thickness w...

Embodiment 2

[0075] Except having changed the addition amount of the titanium dioxide powder into 7 volume%, it carried out similarly to Example 1, and the light reflective anisotropic conductive adhesive agent whose external appearance color was white was obtained. In addition, as in Example 1, the light reflectance evaluation test and the total luminous flux evaluation test of the LED mounting sample were performed. The obtained results are shown in Table 1. Light reflectance results are also expressed in image 3 middle.

Embodiment 3

[0077] Except having changed the addition amount of the titanium dioxide powder into 21 volume%, it carried out similarly to Example 1, and the light-reflective anisotropic conductive adhesive agent whose external color was white was obtained. In addition, as in Example 1, the light reflectance evaluation test and the total luminous flux evaluation test of the LED mounting sample were performed. The obtained results are shown in Table 1. Light reflectance results are also expressed in image 3 middle.

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Abstract

Disclosed is a light-reflective anisotropic electroconductive adhesive agent which is intended to be used for the anisotropic electroconductive connection of a light-emitting element to a wiring board. The light-reflective anisotropic electroconductive adhesive agent comprises a heat-curable resin composition, electroconductive particles, and light-reflective insulating particles. The light-reflective insulating particles are at least one type of inorganic particles selected from the group consisting of titanium oxide particles, boron nitride particles, zinc oxide particles and aluminum oxide particles, or resin-coated metal particles each of which is produced by coating the surface of a scale-like or spherical metal particle with an insulating resin.

Description

technical field [0001] The present invention relates to a light-reflective anisotropic conductive adhesive for anisotropically conductively connecting a light-emitting element to a wiring board, and a light-emitting device formed by mounting a light-emitting element on a wiring board using the adhesive. Background technique [0002] Light-emitting devices using light-emitting diode (LED) elements are widely used, such as Figure 4 As shown, as the structure of the old-fashioned light-emitting device, the LED element 33 is bonded with a die-bonding adhesive 32 on the substrate 31, and the p-electrode 34 and the n-electrode 35 on the upper surface are connected to the connection terminal 36 of the substrate 31 by a gold wire 37. Wire bonding is performed, and the entire LED element 33 is sealed with a transparent mold resin 38 . But when Figure 4 In the case of a light-emitting device, among the light emitted by the LED element 33, the light with a wavelength of 400 to 500 nm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J201/00C09J9/02C09J11/04C09J163/00H01B1/00H01B1/22H01L33/48
CPCH01L2224/73265H01L2224/73204H01L2224/32225H01L33/56C08G59/42H01L33/60H01L2224/48091C08G18/8175C09J9/02C09J163/00H01L2224/16225H01L2224/45144C08K3/22H01L2224/48227C08K3/38H01B1/22C09J11/04H01L2924/07811H01L2224/45147H01L2924/00014H01L2924/00H10K50/00
Inventor 波木秀次蟹泽士行马越英明
Owner DEXERIALS CORP
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