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Method of electroplating silver strike over nickel

A technology of trigger layer and silver layer is applied in the field of electroplating silver trigger layer on nickel to achieve the effect of eliminating toxicity hazards

Active Publication Date: 2015-02-11
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The patent claims that it achieves good adhesion between silver and copper substrates; however silver baths containing chloride or formate give silver deposits that are only semi-bright

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Prepare an aqueous silver trigger solution as shown in the table below.

[0033] Table 1

[0034] components

[0035] Six 50x50 mm pre-nickeled copper test panels were electroplated with the silver trigger solution. Each plate was placed separately in a plating solution containing the silver trigger solution as described in Table 1 above, with the plate serving as the cathode and a platinized titanium electrode serving as the anode. The above cathode, silver trigger solution and anode were electrically connected to a conventional rectifier providing power. at 0.5A / dm 2 Electroplating was performed at a current density for 20 seconds. A 0.1 μm thick silver trigger layer was deposited on each plate.

[0036] After electroplating the silver trigger layer adjacent to the nickel, the silver plate was rinsed with deionized water at room temperature. An additional 5 μm layer of silver was then electroplated on the plate from a silver bath containing the composit...

Embodiment 2

[0041] Prepare an aqueous silver trigger solution as shown in the table below.

[0042] components

content

Silver ion in the form of silver 5,5-dimethylhydantoin

1g / L

5,5-Dimethylhydantoin

70g / L

Sulfamic acid

35g / L

Potassium hydroxide

30g / L

potassium nitrate

20g / L

pH

9.5

[0043] Six 50x50 mm pre-nickeled copper test panels were electroplated with the silver trigger solution. Each plate was placed individually in a plating solution containing the silver trigger solution as described in Table 3 above, with the plate serving as the cathode and a platinized titanium electrode serving as the anode. The above cathode, silver trigger solution and anode were electrically connected to a conventional rectifier providing power. at 0.5A / dm 2 Electroplating was performed at a current density for 20 seconds. A 0.1 μm thick silver trigger layer was deposited on each plate.

[0044] After electroplat...

Embodiment 3

[0047] Prepare an aqueous silver trigger solution as shown in the table below.

[0048] Table 4

[0049] components

[0050] Six 50x50 mm pre-nickeled copper test panels were electroplated with the silver trigger solution. Each plate was placed separately in a plating solution containing the silver trigger solution as described in Table 4 above, with the plate serving as the cathode and a platinized titanium electrode serving as the anode. The above cathode, silver trigger solution and anode were electrically connected to a conventional rectifier providing power. at 0.5A / dm 2 Electroplating was performed at a current density for 20 seconds. A 0.1 μm thick silver trigger layer was deposited on each plate.

[0051] After electroplating the silver trigger layer adjacent to the nickel, the silver plate was rinsed with deionized water at room temperature. An additional 5 μm layer of silver was then plated on the plate from a silver plating solution containing silver ...

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Abstract

A silver electroplating solution is used to electroplate a mirror bright silver layer on a nickel or nickel alloy substrate. The silver electroplating solution is cyanide-free and environmentally friendly.

Description

technical field [0001] The invention relates to a method for electroplating a silver trigger layer on nickel with a cyanide-free silver electroplating solution. More specifically, the present invention relates to electroplating a silver trigger layer on nickel with a cyanide-free silver plating solution, wherein an additional silver metal layer is electroplated on top of the silver trigger layer to form a specular bright deposit on the nickel. Background technique [0002] Silver plating is often used for decoration and tableware. Due to its excellent electrical properties, silver plating has a wide range of applications in the electronics industry, such as switches, connectors, and current paths for optoelectronic devices. [0003] Many traditional silver plating solutions are highly toxic because they contain cyanide. In most cases, the source of silver ions in the plating solution comes from water-soluble silver cyanide salts. Attempts have been made to reduce or elimi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/46
CPCC25D3/46C25D5/12C25D3/50C25D5/10C25D5/627
Inventor W·张-伯格林格E·佐克斯M·克劳斯
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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