Photosensitive polyester composition for use in forming thermally cured film
A thermal curing and photosensitive technology, applied in the application field of the cured film, can solve the problem of no report of having a photosensitive flattening film, etc., and achieve the effects of high heat resistance, high transparency and high solvent resistance
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[0188] The following examples are given to illustrate the present invention in more detail, but the present invention is not limited to these examples.
[0189] [Abbreviated symbols used in Examples]
[0190] The meanings of the abbreviated symbols used in the following examples are as follows.
[0191]
[0192] BPDA: biphenyltetracarboxylic dianhydride
[0193] HBPDA: 3,3'-4,4'-Dicyclohexyltetracarboxylic dianhydride
[0194] HBPA: hydrogenated bisphenol A
[0195] THPA: 1,2,5,6-tetrahydrophthalic anhydride
[0196] BTEAC: Benzyltriethylammonium Chloride
[0197] TPPB: tetraphenyl bromide
[0198] GMA: glycidyl methacrylate
[0199] GME: glycidyl methyl ether
[0200] DTBC: di-tert-butylcresol
[0201]
[0202] CBDA: Cyclohexanetetracarboxylic dianhydride
[0203] DA-4P: 1,3-bis(4-aminophenyl)benzene
[0204] DA-1M: 4,4'-bis(4-aminophenoxy)diphenylsulfone
[0205] TA: 1,2,4-trimesic anhydride
[0206] DDS: 4,4'-Diaminodiphenylsulfone
[0207] pDA: p-phenyle...
Synthetic example 1
[0228] HBPDA 40.0g, BPDA 8.23g, HBPA 49.3g, THPA 5.96g, BTEAC 0.18g, TPPB 0.33g were reacted in PGMEA 241.96g at 120°C for 17 hours to obtain a solution of the specific polymer (solid content Concentration: 30.0% by mass) (P1). The obtained specific polymer had Mn of 1,500 and Mw of 3,430.
Synthetic example 2
[0230] 18.42 g of GMA, 0.057 g of DTBC, and 42.99 g of PGME were added to 252.00 g of the solution (P1) of the specific polymer obtained in Synthesis Example 1, and reacted at 110° C. for 9 hours to obtain a polyester solution (solid content Concentration: 30.0% by mass) (P2). Mn of the obtained polyester was 1,260, and Mw was 6,880.
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