Photosensitive polyester composition for use in forming thermally cured film
A heat-curing and photosensitive technology, which is applied in the application field of the cured film, can solve the problem of no photosensitive flattening film reported, and achieve the effects of high heat resistance, high transparency, and high solvent resistance
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[0188] The following examples are given to illustrate the present invention in more detail, but the present invention is not limited to these examples.
[0189] [Abbreviated symbols used in Examples]
[0190] The meanings of the abbreviated symbols used in the following examples are as follows.
[0191]
[0192] BPDA: biphenyltetracarboxylic dianhydride
[0193] HBPDA: 3,3'-4,4'-Dicyclohexyltetracarboxylic dianhydride
[0194] HBPA: hydrogenated bisphenol A
[0195] THPA: 1,2,5,6-tetrahydrophthalic anhydride
[0196] BTEAC: Benzyltriethylammonium Chloride
[0197] TPPB: tetraphenyl bromide
[0198] GMA: glycidyl methacrylate
[0199] GME: glycidyl methyl ether
[0200] DTBC: di-tert-butylcresol
[0201]
[0202] CBDA: Cyclohexanetetracarboxylic dianhydride
[0203] DA-4P: 1,3-bis(4-aminophenyl)benzene
[0204] DA-1M: 4,4'-bis(4-aminophenoxy)diphenylsulfone
[0205] TA: 1,2,4-trimesic anhydride
[0206] DDS: 4,4'-Diaminodiphenylsulfone
[0207] pDA: p-phenyle...
Synthetic example 1
[0228] HBPDA 40.0g, BPDA 8.23g, HBPA 49.3g, THPA 5.96g, BTEAC 0.18g, TPPB 0.33g were reacted in PGMEA 241.96g at 120°C for 17 hours to obtain a solution of the specific polymer (solid content Concentration: 30.0% by mass) (P1). The obtained specific polymer had Mn of 1,500 and Mw of 3,430.
Synthetic example 2
[0230] 18.42 g of GMA, 0.057 g of DTBC, and 42.99 g of PGME were added to 252.00 g of the solution (P1) of the specific polymer obtained in Synthesis Example 1, and reacted at 110° C. for 9 hours to obtain a polyester solution (solid content Concentration: 30.0% by mass) (P2). Mn of the obtained polyester was 1,260, and Mw was 6,880.
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