Light source module and adhesive component thereof

An optical component and component technology, which is applied in electrical components, semiconductor devices, circuits, etc., can solve the problems of variation in luminous brightness and chromaticity of phosphor powder distribution, and high manufacturing costs, so as to promote cost reduction, increase photoelectric conversion rate, increase effect of brightness

Inactive Publication Date: 2012-03-14
YOSHINAGA TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, in the process of combining light-emitting diodes with phosphor powder and sealant, not only is the uneven distribution of phosphor powder likely to cause variations in luminance and chromaticity, but also a large number of consumables (such as needles or tubing), which in turn leads to prohibitive manufacturing costs

Method used

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  • Light source module and adhesive component thereof
  • Light source module and adhesive component thereof
  • Light source module and adhesive component thereof

Examples

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Embodiment Construction

[0047] See first figure 1 , the adhesive member 10 according to an embodiment of the present invention can be set in a light source module, which mainly includes phosphor powder 11 , a glue 12 , a first outer layer 13 and a second outer layer 14 . In this embodiment, the first outer layer 13 is a transparent material, the second outer layer 14 is a release film, and the colloid 12 is located between the first and second outer layers 13, 14. Meanwhile, the phosphor powder 11 is evenly distributed in the colloid 12 . It should be understood that a light source (such as a blue light emitting diode chip) in the light source module can emit light and interact with the fluorescent powder 11 in the colloid 12, so that the light can produce a predetermined color (such as white light ).

[0048] For example, the colloid 12 may contain acrylic, pressure sensitive adhesive (Pressure Sensitive Adhesive, PSA) or optical clear adhesive (Optical Clear Adhesive, OCA) and other materials. In...

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Abstract

The invention relates to an adhesive component capable of increasing the light source use efficiency of a light emitting diode. The adhesive component is mainly characterized in that: fluorescent powder is transferred from inside to outside of a traditional white light emitting diode package, then a blue light emitting diode is used, the fluorescent powder is coated on a transparent adhesive material, and the mixed adhesive material is uniformly coated on a transparent substrate to form a fluorescent adhesive belt form. Therefore, the blue light emitting diode and the transparent fluorescent adhesive belt can achieve a white light emitting effect, and the use efficacy of the light emitting diode is increased by the manner.

Description

technical field [0001] The invention relates to an adhesive member, in particular to an adhesive member which can be arranged in a light source module and can increase the use efficiency of light-emitting diodes. Background technique [0002] Generally, the light-emitting diode components that can emit white light usually use blue light-emitting diode chips mixed with phosphor powder and sealant to form a light-emitting diode packaging component. The use of light powder area, it has become a method that can be used to mass-produce light-emitting diode components. [0003] However, in the process of combining light-emitting diodes with phosphor powder and sealant, not only is the uneven distribution of phosphor powder likely to cause variations in luminance and chromaticity, but also a large number of consumables (such as needles or tubes), leading to prohibitive manufacturing costs. In view of this, how to overcome the above common problems has become an important issue. ...

Claims

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Application Information

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IPC IPC(8): H01L33/50
Inventor 刘介中洪吉永
Owner YOSHINAGA TECH
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