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Semiconductor Wafer Cooling Device

A cooling device and semiconductor technology, applied in the manufacture of semiconductor/solid-state devices, discharge tubes, electrical components, etc., can solve problems such as temperature difference, deviation of electrical characteristics of the life of semiconductor components, etc., to suppress temperature difference, suppress temperature unevenness, close contact sex-enhancing effect

Inactive Publication Date: 2012-03-14
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Due to such a temperature difference in the plane of the semiconductor wafer and between wafers, there is a problem that the lifetime of the semiconductor element produced by cutting out the semiconductor wafer and other electrical characteristics vary.

Method used

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  • Semiconductor Wafer Cooling Device
  • Semiconductor Wafer Cooling Device
  • Semiconductor Wafer Cooling Device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0038] figure 1 is a block diagram of a semiconductor wafer cooling device according to Embodiment 1, figure 1 (a) is a plan view, figure 1 (b) is figure 1 A-A section view in (a).

[0039] In the semiconductor wafer cooling device of the present embodiment, a plurality of semiconductor wafers 10 are placed on the tray 1 on the placement surface thereof. A cooling duct 2 is formed inside the tray 1 , and the semiconductor wafer 10 is cooled by a cooling medium such as cooling water flowing through the cooling duct 2 . For example, cooling duct 2 such as figure 1 As shown in (a), one cooling duct is arranged in a folded shape (serpentine arrangement) between both ends of the tray 1 .

[0040] Furthermore, a vacuum duct 3 is formed inside the tray 1 so as not to interfere with the cooling duct 2 , and an opening of the vacuum duct 3 is formed on the mounting surface of the tray 1 . The inside of the vacuum duct 3 is depressurized by a vacuum pump, and the semiconductor waf...

Embodiment approach 2

[0046] figure 2 It is a block diagram of the semiconductor wafer cooling apparatus of Embodiment 2. In the semiconductor wafer cooling device of this embodiment, a plurality of semiconductor wafers 10 are placed on the loading surface of the tray 1 (see figure 1 ). A cooling duct 2 is formed inside the tray 1 , and the semiconductor wafer 10 is cooled by a cooling medium such as cooling water flowing through the cooling duct 2 . The cooling duct 2 is a single cooling duct arranged in a meandering manner (serpentine arrangement) between both ends of the tray 1 .

[0047] Assuming that one side of a square chip cut out from the semiconductor wafer 10 is a (mm), and the side wall thickness of the cooling duct 2 is b (mm), the distance between adjacent ducts of the cooling duct 2 ( Pipe interval) c (mm) satisfy:

[0048] [Formula 2]

[0049]

[0050] . For example, when one side of the square chip is set as a=22.5 (mm), and the side wall thickness of the cooling pipe 2 i...

Embodiment approach 3

[0055] image 3 , Figure 4 It is a block diagram of the semiconductor wafer cooling apparatus of Embodiment 3. In the semiconductor wafer cooling device of this embodiment, a plurality of semiconductor wafers 10 are placed on the loading surface of the tray 1 (see figure 1 ). A pair of cooling ducts 2a, 2b are formed inside the tray 1, and the semiconductor wafer 10 is cooled by a cooling medium such as cooling water flowing in opposite directions through the cooling ducts 2a, 2b.

[0056] The cooling ducts 2a and 2b each have a structure in which a plurality of branch ducts are connected in parallel, and the branch ducts of the cooling duct 2a and the branch ducts of the cooling duct 2b are alternately arranged on a plane parallel to the mounting surface of the tray 1 .

[0057] Figure 4 (a) is the figure which looked at the cooling duct 2a, 2b from the back side of the tray 1 (the surface opposite to a mounting surface), Figure 4 (b) is from Figure 4 (a) View the c...

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Abstract

The invention relates to a semiconductor wafer cooling device and aims to provide the circumference inhibiting temperature deviation of a semiconductor wafer as a radiated object and cooling the semiconductor wafer at the same time. The semiconductor wafer cooling device is provided with a tray (1) having a carrying face for carrying the semiconductor wafer (10); a cooling channel (2) arranged in the tray (1) through which cooling medium cooling the semiconductor wafer (10) carried on the carrying face flows; and a vacuum channel (3) provided with an opening in the carrying face, arranged on the tray (1) and absorbing the semiconductor wafer (10) carried on the carrying face.

Description

technical field [0001] The present invention relates to a semiconductor wafer cooling device including a tray for placing and cooling a semiconductor wafer as an object to be irradiated when irradiating radiation. Background technique [0002] The time for electrons to recombine in a p-type semiconductor material or the time for holes to recombine in an n-type semiconductor material is called the minority carrier lifetime. In order to recombine more rapidly the remaining minority carriers after conduction, it is necessary to control the lifetime, and this lifetime control is performed by diffusing heavy metals such as gold and platinum or by irradiating charged particles such as electrons and protons. [0003] In order to prevent the temperature rise of the semiconductor wafer in such a radiation irradiation process, a cooling duct through which a cooling medium such as cooling water flows is provided in the tray on which the semiconductor wafer is placed, and the wafer is c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00
CPCH01L21/67109H01L21/6838H01L21/683H01L21/02H01J37/20
Inventor 野口贵也
Owner MITSUBISHI ELECTRIC CORP
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