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Intermediate layer assembly for connecting Si3N4 ceramic and stainless steel and connecting method

A connection method and stainless steel technology, applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of low joint strength and large residual stress, and achieve the effect of high connection strength, good wetting performance and simple process

Inactive Publication Date: 2012-02-22
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Technical problem: the purpose of the invention is to solve the problem of Si 3 N 4 There are problems such as excessive residual stress and low joint strength in the connection between ceramics and stainless steel, and a connection Si 3 N 4 Intermediate layer component and connection method of ceramics and stainless steel

Method used

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  • Intermediate layer assembly for connecting Si3N4 ceramic and stainless steel and connecting method
  • Intermediate layer assembly for connecting Si3N4 ceramic and stainless steel and connecting method
  • Intermediate layer assembly for connecting Si3N4 ceramic and stainless steel and connecting method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] 1. Selection of middle-level components:

[0026] 1. The purity of Ti foil 2 is 99.7% and the thickness is 10μm;

[0027] 2. The composition and content of Ag-Cu solder foil 3 are as follows by mass percentage: Ag: 72.0%, Cu: 28.0%, and a thickness of 150μm;

[0028] 3. The purity of Ni foil 4 is 99.9% and the thickness is 600μm.

[0029] 2. Connection steps and methods:

[0030] (1) The Si to be connected 3 N 4 The end surface of the ceramic 1 sample was polished with 3.5um diamond paste, and Ti foil 2, Ag-Cu solder foil 3, Ni foil 4 and stainless steel 5 were polished with No. 5 metallographic sandpaper. Then put them together in acetone for ultrasonic cleaning for 10 minutes;

[0031] (2) Combine Ti foil 2, Ag-Cu solder foil 3, Ni foil 4, stainless steel 5 and Si 3 N 4 Ceramic 1 Press Si 3 N 4 The order of ceramic 1, Ti foil 2, Ag-Cu solder foil 3, Ni foil 4, Ag-Cu solder foil 3, and stainless steel 5 are closely mounted in a special fixture, such as figure 1 As shown; at the ...

Embodiment 2

[0035] 1. Selection of middle-level components:

[0036] 1. The purity of Ti foil 2 is 99.7% and the thickness is 5μm;

[0037] 2. The composition and content of the Ag-Cu solder foil 3 are as follows in terms of mass percentage: Ag: 72.0%, Cu: 28.0%, and a thickness of 100 μm;

[0038] 3. The purity of Ni foil is 99.7% and the thickness is 800μm.

[0039] 2. Connection steps and methods:

[0040] (1) The Si to be connected 3 N 4 The end face of the ceramic sample is polished with 3.5um diamond paste, and Ti foil 2, Ag-Cu solder foil 3, Ni foil 4 and stainless steel 5 are polished with No. 5 metallographic sandpaper; then they are placed in acetone for ultrasonic Wash for 10 minutes;

[0041] (2) Combine Ti foil 2, Ag-Cu solder foil 3, Ni foil 4, stainless steel 5 and Si 3 N 4 Ceramic 1 Press Si 3 N 4 The order of ceramic 1, Ti foil 2, Ag-Cu solder foil 3, Ni foil 4, Ag-Cu solder foil 3, and stainless steel 5 are closely mounted in a special fixture, such as figure 1 As shown; at the sa...

Embodiment 3

[0045] 1. Selection of middle-level components:

[0046] 1. The purity of Ti foil 2 is 99.7% and the thickness is 8μm;

[0047] 2. The composition and content of Ag-Cu solder foil 3 are as follows by mass percentage: Ag: 72.0%, Cu: 28.0%, and the thickness is 120μm;

[0048] 3. The purity of Ni foil is 99.7% and the thickness is 600μm.

[0049] 2. Connection steps and methods:

[0050] (1) The Si to be connected 3 N 4 The end face of the ceramic sample is polished with 3.5um diamond paste, and Ti foil 2, Ag-Cu solder foil 3, Ni foil 4 and stainless steel 5 are polished with No. 5 metallographic sandpaper; then they are placed in acetone for ultrasonic Wash for 10 minutes;

[0051] (2) Combine Ti foil 2, Ag-Cu solder foil 3, Ni foil 4, stainless steel 5 and Si 3 N 4 Ceramic 1 Press Si 3 N 4 The order of ceramic 1, Ti foil 2, Ag-Cu solder foil 3, Ni foil 4, Ag-Cu solder foil 3, and stainless steel 5 are closely installed in a special fixture; at the same time, a small weight is placed on ...

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Abstract

The invention discloses an intermediate layer assembly for connecting Si3N4 ceramic and stainless steel and a connecting method. The intermediate layer assembly is formed by sequentially jointing a Ti foil, an Ag-Cu solder foil, a Ni foil and an Ag-Cu solder foil. The connecting method comprises the following steps of: flattening, polishing and cleaning a Si3N4 ceramic test sample to be connected and the intermediate layer assembly; and tightly installing the Si3N4 ceramic, Ti, Ag-Cu, Ni, Ag-Cu and stainless steel in sequence, and welding in a vacuum furnace. The residual stress of the ceramic and the stainless steel joint can be relieved, the strength of the joint is improved, and the method is simple and convenient to implement.

Description

Technical field: [0001] The present invention relates to the connection of dissimilar materials, and more specifically, to a connection of Si 3 N 4 Ceramic and stainless steel intermediate layer components and connection methods belong to the field of welding technology. Background technique: [0002] Structural ceramic materials have unique properties such as high strength, high temperature resistance, and corrosion resistance, but their shortcomings such as high brittleness, strength dispersion, and difficulty in processing, limit its application as a whole mechanism in engineering. The realization of the connection between structural ceramics and metals is of great significance to the expansion of the application fields of ceramics. [0003] The connection between ceramics and metals is mainly active brazing and diffusion welding. In addition, there are some new methods such as transient liquid phase connection and secondary PTLP. Due to the large differences in the physical an...

Claims

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Application Information

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IPC IPC(8): B23K1/008B23K1/19B23K1/20
Inventor 邹家生许祥平高飞严铿
Owner JIANGSU UNIV OF SCI & TECH
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