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Method for encapsulating chip with excellent radiating performance

A technology of chip packaging and heat dissipation performance, which is applied in the manufacture of electrical components, electric solid devices, semiconductor/solid state devices, etc., can solve problems affecting chip stability and limited heat dissipation capacity, and achieve easy packaging process, excellent heat dissipation performance and practicality good performance effect

Inactive Publication Date: 2012-02-08
常熟市广大电器有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing chip packaging structure, the chip is mostly wrapped in the injection molding body, and the heat transfer is mainly through the metal connected to the chip and the outside world. The heat dissipation capacity is limited, which affects the stability of the chip operation.

Method used

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  • Method for encapsulating chip with excellent radiating performance
  • Method for encapsulating chip with excellent radiating performance

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Embodiment Construction

[0015] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0016] figure 1 It is a process step diagram of a chip packaging method with excellent heat dissipation performance in an embodiment of the present invention; the chip packaging method mainly includes the following steps: a) installing the substrate, b) installing the chip, c) performance testing, d) sealing and packaging, e ) Coating heat dissipation layer, f) Finished product inspection.

[0017] The specific implementation steps are as follows:

[0018] a) Install the substrate, first, apply a thermosetting adhesive between the substrate and the circuit board, and the thickness of the adhesive layer is controlled at 10-20um; then, use gold wi...

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Abstract

The invention discloses a method for encapsulating a chip with excellent radiating performance. The method for encapsulating the chip mainly comprises the following steps of: a) installing a substrate; b) installing the chip; c) detecting the performance of the chip; d) sealing by using a sealing gum; e) coating a heat-radiating layer; and f) detecting a finished product. The invention discloses the method for encapsulating the chip with excellent radiating performance. In the process of executing the encapsulating method, two encapsulating processes are carried out on the chip; the heat radiating performance of the chip can be effectively improved while a favorable encapsulating performance is ensured; and the high-efficiency operation of the chip is ensured. Simultaneously, in the process of executing the encapsulating method, an external auxiliary radiating device does not need to be added, thus the encapsulating cost is reduced, the encapsulating process is easy to achieve, and the practicality is excellent.

Description

technical field [0001] The invention relates to a chip packaging structure, in particular to a chip packaging method for effectively improving the heat dissipation performance of a chip, and belongs to the technical field of chip packaging. Background technique [0002] Chip packaging technology is a process technology that wraps the chip to avoid contact between the chip and the outside world and prevent damage to the chip from the outside world. Impurities and bad gases in the air, and even water vapor will corrode the precision circuits on the chip, resulting in a decrease in electrical performance. Different packaging technologies differ greatly in terms of manufacturing processes and processes, and packaging also plays a vital role in the performance of the memory chip itself. With the rapid development of optoelectronic and microelectronic manufacturing technology, electronic products are always developing in the direction of smaller, lighter and cheaper, so the packa...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L23/367
Inventor 徐子旸
Owner 常熟市广大电器有限公司
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