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Dual-bonding wire head lead bonding device

A technology of wire bonding and wire lead, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problem that the bonding efficiency of wire bonding machines is difficult to be greatly improved, and achieve the effect of improving cost performance and wire bonding efficiency

Inactive Publication Date: 2012-02-01
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, limited by physical conditions, there is a physical limit to increase the bonding speed by improving the performance of unit components, and the efficiency cannot be infinitely improved, that is, it is difficult to greatly improve the bonding efficiency of a single wire bonding machine.

Method used

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  • Dual-bonding wire head lead bonding device
  • Dual-bonding wire head lead bonding device
  • Dual-bonding wire head lead bonding device

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Experimental program
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Embodiment Construction

[0013] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0014] see figure 1 , the present invention includes two sets of identical welding wire heads, each welding wire head includes a wire clamp 26, a lighter support 16, a horn 12, a splitting knife 14, a horn clamping seat 11, and a horn support 8. The welding head rotating shaft 36, the rotating shaft support bearing 34, the shaft support frame 38, the motor support 7, the linear motor 1, the linear encoder 28, and the vision system 31. Each welding wire head is fixed on the support frame 6 by connecting bolts 5, and the support is fixed on the planar motion platform by bolts 33. Each welding wire head can rotate around the rotating shaft 36 under the up and down driving of the linear motor 1, and is combined with the wire clamp driving wire feeding system 26, the electronic ignition system 16, the horizontal XY direction plane movement system, ...

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Abstract

The invention discloses a micro-electronic chip lead bonding device with dual bonding wire heads. The device comprises two sets of same welding wire heads, the position of a fastening bolt in a groove at the lower part of a base of the welding wire heads is adjusted manually, and the relative positions and the distance between the dual welding wire heads can be adjusted and changed. Under the coordination control action of a shared controller program, independent wire solder or simultaneous wire solder can be carried out on each welding wire head, the lead bonding efficiency of the micro-electronic chip lead bonding device is doubled compared with the lead bonding efficiency of a single-welding wire head bonding machine, and each welding wire head is fixedly connected with a welding wire head bearing by an attachment bolt. The lead bonding device formed by configuring two or more than two welding wire heads on one bonding machine can finish the wire solder task of lead interconnection jointly by division and cooperation of responsibilities of adjustment and programming aiming at different parts, so that the bonding efficiency of a chip can be improved manyfold.

Description

technical field [0001] The invention relates to a wire bonding device for microelectronic chip packaging, in particular to a wire bonding device with two welding heads working together. technical background [0002] Wire bonding is the dominant method for microelectronic packaging. In order to increase the speed of wire bonding, the bonding equipment has made a lot of improvements in the drive source, bonding mechanism, even the feeding and discharging system and the layout of the workpiece, including the extensive use of linear motor direct drive instead of stepping motor plus ball for the driving source. The screw drive mode, the mechanism adopts a new mechanism combining parallel and series, the chips of the same type are arranged in an array at equal intervals, etc., and the bonding movement performance is significantly improved. However, limited by physical conditions, there is a physical limit to increase the bonding speed by improving the performance of unit componen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60
CPCH01L2224/78301H01L24/78H01L2924/00014H01L2224/78H01L2224/48H01L2924/00012
Inventor 李群明韩雷邓华张世伟
Owner CENT SOUTH UNIV
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