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Halogen-free lead-free tin wire

A technology of lead-free solder and solder wire, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve problems such as poor wetting and poor welding, and achieve the effect of full solder joints and high reliability

Inactive Publication Date: 2013-05-29
JIANGXI UNIV OF SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the environmental requirements become more and more stringent, lead-free solder wires have been mostly used at present. Due to the influence of the wetting properties of the lead-free alloy itself, halogen activators are commonly used in lead-free solder wires to solve soldering problems. Poor wetting, poor welding, etc.
However, because the halogen-containing active agent will produce harmful gas during the welding process, it has been strictly restricted by many countries or regions.

Method used

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  • Halogen-free lead-free tin wire
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  • Halogen-free lead-free tin wire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The components in Example 1 per unit mass are: 96 parts of tin; 0.7 part of copper; 0.2 part of rosin; 0.1 part of diethylene glycol monobutyl ether; 0.05 part of hydrogenated castor oil; 0.01 part of nitrogen azole; 0.02 part of polyethylene glycol octylphenyl ether; 0.01 part of viscosity modifier, 0.025 part of active compound.

[0030] During production, tin and copper materials are first melted, mixed, and stirred evenly, and then poured into blocks, and the blocks should be convenient for subsequent drawing operations.

[0031] When making flux, first melt the rosin, and then add: diethylene glycol monobutyl ether, hydrogenated castor oil, glutaric acid, benzotriazole, polyethylene glycol octylphenyl ether, viscosity modifier, active compound. After fully stirring evenly, flux is obtained.

[0032] When drawing the above bulk solder, the flux is injected into the hollow tin wire to form the solder wire of the present invention.

[0033] When this embodiment is ...

Embodiment 2

[0035] 0.6 parts of copper; 0.2 parts of rosin; 0.2 parts of ethylene glycol propyl ether; 0.06 parts of hydrogenated castor oil; 0.4 parts of ethylenediamine; 0.02 parts; 0.01 parts of polyethylene glycol octyl phenyl ether; 0.02 parts of viscosity modifier, 0.04 parts of active compound.

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Abstract

The invention relates to the technical field of tin wires, in particular to a composite halogen-free lead-free tin wire in line with the EU (European Union) directive. The tin wires comprise the following components in parts by per unit mass: 96-98 parts of tin, 0.6-0.7 part of copper, 0.1-0.2 part of resin, 0.1-0.2 part of non-fluorochloro environmentally-friendly organic solvent, 0.05-0.06 part of thixotropic agnet, 0.02-0.4 part of organic active agent, 0.01-0.02 part of corrosion inhibitor, and 0.01-0.02 part of surfactant, wherein the tin and the copper are the solder of the tin wire, and others are soldering flux. By using said technical scheme in the invention, the product is in line with relative directive of the EU and free from lead and relative halogen. Furthermore, the reliability of the welding is high, bad welding spot cannot be formed, and the welding spot is full and bright.

Description

Technical field: [0001] The invention relates to the technical field of solder wire, in particular to a lead-free solder wire that does not contain halogen and conforms to the EU REACH directive. Background technique: [0002] Solder wire is a kind of alloy solder. Usually, solder wire is used as solder when soldering with an electric soldering iron. For the convenience of the user, it is usually set as a "wire" roll of different thickness, and the user can pull it out when using it, and use it with an electric soldering iron. Solder wire secures electronic components to circuit boards. When it is heated to a certain temperature, it will be melted, so that the soldered components and the circuit board are connected together, and after cooling down from the melting point, it will solidify to form a fixed solder joint. [0003] The solder wire used in the past is tin-lead solder wire, that is, the solder wire is synthesized with about 60% tin and 40% lead, and has a low melt...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/363
Inventor 吴伟明
Owner JIANGXI UNIV OF SCI & TECH
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