MEMS (micro electro mechanical system) wafer-level three-dimensional mixing integration packaging structure and method

Abstract

The invention provides an MEMS (micro electro mechanical system) wafer-level three-dimensional mixing integration packaging structure and method based on a Chip to Wafer stacking mode. The method is characterized in that an MEMS device wafer and a silicon cover plate wafer are bonded through low-temperature bonding of glass slurry so as to realize wafer-level airtight / vacuum packaging and finish protection on movable components of the MEMS device; a CMOS (complementary metal oxide semiconductor) chip such as ASIC (application specific integrated circuit) and the like are mounted on and interconnected with the surface of the silicon cover plate wafer in a Chip to Wafer stacking mode so as to realize three-dimensional mixing integration of the CMOS chip such as ASIC and the like and the MEMS device wafer; discrete integrated micro systems are mounted on a low-cost organic substrate; multi-layer interconnection of the CMOS chip, the MEMS device and the substrate is finished through a lead bonding mode; and low-stress plastic package material is filled in a dam mode to protect the integrated micro systems and improve the environment reliability, thus forming an MEMS wafer-level three-dimensional mixing integration packaging structure which has the advantages of high density, low cost, low stress and high reliability and is easy to process.

Description

technical field [0001] The present invention relates to a microelectromechanical system (MEMS) wafer-level three-dimensional hybrid integrated packaging structure and method, more precisely, the present invention relates to a MEMS three-dimensional hybrid integrated packaging method, that is, using Chip to Wafer (chip to wafer A wafer-level three-dimensional hybrid integration method for IC chips and MEMS devices in a laminated manner, which belongs to the field of microsystem packaging. Background technique [0002] Microelectromechanical systems (MEMS) include microsensors and drivers, as well as auxiliary integrated circuits and functional control systems for device function control and signal transmission, conditioning and processing. The integration of MEMS is to package microsensors (or drivers) with CMOS chips such as application-specific integrated circuits (ASICs) and operational amplifier integrated circuits to complete the sensing (or driving) function. At presen...

AI Technical Summary

Problems solved by technology

After the wafer-level packaging is completed, it is necessary to further protect the device with the packaging shell. Many famous manufacturers in the world tend to use ceramic shells and QFN (Quad Flat Non-Lead) pins in the early stage, but the cost is relatively high.

There is still a gap between this and the current requirement to reduce the cost of MEMS packaging as much as possible

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