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High-power base plate effectively integrating circuit board and radiator and manufacturing method thereof

A manufacturing method and circuit board technology, applied in the direction of circuits, electric solid-state devices, semiconductor devices, etc., can solve the problems affecting the quality and life stability of high-power LED street lamps, the heat of LED lamps cannot be exported in time, and thermal obstacles, etc., to achieve The effect of low price, easy purchase and stable performance

Inactive Publication Date: 2011-09-14
周波
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the heat passes through multiple layers and heat transfer of various media, often causing the heat generated by the LED lamp to be unable to be exported in time, or the heat generated by the LED lamp is not exported smoothly or even forms a thermal barrier, which seriously affects the quality and life of the high-power LED street lamp. and job stability

Method used

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  • High-power base plate effectively integrating circuit board and radiator and manufacturing method thereof
  • High-power base plate effectively integrating circuit board and radiator and manufacturing method thereof
  • High-power base plate effectively integrating circuit board and radiator and manufacturing method thereof

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Effect test

Embodiment 1

[0041] Taking high-power LED lighting equipment as an example, the specific structure and manufacturing method of the present invention are described in comparison.

[0042] Such as figure 1As shown, the heat dissipation mode of the traditional LED lamp is: the electronic component 7 (LED lamp) is connected to the aluminum substrate 8, the thermal conductive silica gel 9 is coated between the electronic component 7 and the aluminum substrate 8, and the aluminum substrate 8 includes soldering copper foil, epoxy resin Or insulating material and aluminum alloy sheet. An aluminum alloy heat sink 10 is installed under the aluminum base plate 8 , and thermal conductive silicon grease 11 is coated between the aluminum base plate 8 and the aluminum alloy heat sink 10 .

[0043] Such as figure 2 As shown, the heat dissipation method of the present invention is: the electronic component 7 is directly bonded or welded on the metal heat dissipation plate 1, which avoids the heat dissip...

Embodiment 2

[0058] The electronic component installation area 4 is fixed with an electronic component 7 through the insulating ceramic glue 12, and the circuit area is covered with a heat-conducting and insulating ceramic circuit layer 2 formed by the insulating ceramic glue 12, and the thickness of the heat-conducting and insulating ceramic circuit layer 2 is between 0.1 and 0.3 mm , thermally conductive and insulating ceramic circuit layer 2 is covered with copper foil circuit 3, solder joint 5 is arranged on copper foil circuit 3, and waterproof insulation is sprayed on the surface of metal heat sink 1 except solder joint 5 and electronic component installation area 4 paint6.

[0059] The steps of the manufacturing method of the high-power substrate in which the circuit board and the heat sink are efficiently integrated are as follows:

[0060] a. The area on the metal cooling plate 1 except the electronic component installation area 4 is coated with insulating ceramic glue 12, and a l...

Embodiment 3

[0068] The manufacturing method of the high-power substrate in which the circuit board and the radiator are efficiently integrated can also be:

[0069] a. Print the insulating ceramic glue 12 on the area of ​​the metal heat dissipation plate 1 except the electronic component installation area 4 through screen printing, and make the heat-conducting and insulating ceramic circuit layer 2, and the thickness of the heat-conducting and insulating ceramic circuit layer 2 is between 0.1 and 0.3 mm. ;

[0070] b. After the insulating ceramic circuit layer 2 is cured at 120-180°C for 5-15 minutes, a layer of solderable conductive copper paste is printed on the heat-conducting insulating ceramic circuit layer 2 through a screen to form a copper foil circuit 3;

[0071] c. For the copper foil circuit 3 formed by screen printing solderable conductive copper paste, directly cure at 120-180°C for 10-25 minutes;

[0072] d. Perform tin spraying treatment on each solder joint 5 on the coppe...

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Abstract

The invention discloses a manufacturing method of a high-power base plate effectively integrating a circuit board and a radiator, belongs to the field of electronic printing circuit board and electronic element radiation, and particularly discloses the high-power base plate effectively integrating the circuit board and the metal radiator and having higher radiating performance and the manufacturing method thereof. The structure of the high-power base plate comprises a metal heating panel (1), and is characterized in that: a heat-conducting and insulating ceramic circuit layer (2) is coated on the metal heating panel (1); a copper foil circuit (3) is arranged on the heat-conducting and insulating ceramic circuit layer (2); a welding spot (5) is arranged on the copper foil circuit (3); and waterproof insulating paint (6) is sprayed onto the areas, except the welding spot (5) and an electronic element mounting area (4), on the surface of the metal heating panel (1). Compared with the prior electronic element radiation mode, the high-power base plate is high in heat-radiation efficiency and stable in performance, and has cheap and readily available raw materials. The method is evolved from the traditional mature process and is suitable for mass production.

Description

technical field [0001] A high-power substrate with efficient integration of a circuit board and a radiator and a manufacturing method thereof, which belong to the field of electronic component heat dissipation in the field of electronic printed circuit boards, and specifically relate to a large circuit board and a metal radiator that are efficiently integrated and have better heat dissipation performance power substrate. Background technique [0002] As a new type of lighting source, high-power LED (light-emitting diode) lamps have the advantages of energy saving, environmental protection, long service life, and low consumption. They have been widely used in home lighting, commercial lighting, road lighting, industrial and mining lighting and other fields. At present, power-type white light LEDs can only convert about 15-25% of electrical energy into light energy, and almost all of the remaining energy is converted into heat energy. With the increase of LED power, the heat ...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/64H01L33/00F21V29/00F21Y101/02F21V29/10F21V29/508F21Y115/10
CPCH01L2224/48091H01L2224/48247H01L2924/181H01L2924/00014H01L2924/00012
Inventor 周波
Owner 周波
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