Chip radiation method, and related device and system
A technology of chip heat dissipation and heat sink, which is applied in the manufacture of electrical components, circuits, printed circuits, etc., can solve the problems of difficult installation and fixing, bulky heat sink, and large area of heat dissipation holes, and achieve low cost, small size, and easy The effect of installation
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[0024] Embodiments of the present invention provide a chip heat dissipation method, a related device and a system, which are used to improve the heat dissipation efficiency of a chip on the premise of low cost and easy installation.
[0025] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0026] The chip cooling method in the embodiment of the present invention is described below, ple...
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