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Power module containing special power terminal

A technology of power terminals and power modules, which is applied in the field of power electronics, can solve the problems of easy falling off and failure of power terminals, and achieve the effects of increasing overall life, balancing resistance, and not easy falling off

Inactive Publication Date: 2011-05-18
嘉兴斯达微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the problem that the power terminal of the existing power module is easy to fall off and cause failure after working for a long time

Method used

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  • Power module containing special power terminal
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Embodiment Construction

[0014] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0015] As shown in the figure, the power module of the present invention is an insulated gate bipolar transistor (IGBT) module, which includes an insulated gate bipolar transistor chip 9, an insulating substrate 10, a heat sink 8, a power terminal 4, a power terminal 5, a power Terminal 6, bonding aluminum wire 7, plastic shell 11. The insulated gate bipolar transistor chip 9 is reflow soldered on the conductive copper layer of the insulating substrate (DBC) 10, and the insulating substrate (DBC) 10 is directly welded on the heat sink 8 by brazing. The power terminal 4 , the power terminal 5 and the power terminal 6 are soldered on an insulating substrate (DBC) 10 by reflow soldering. The insulated gate bipolar transistor chip 9 is electrically connected to the corresponding conductive layer of the insulating substrate (DBC) 10 through aluminum wire 7 ...

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Abstract

The invention discloses a power module containing a special power terminal, comprising a chip, an insulating substrate, a heat dissipation plate, a power terminal and a shell, wherein the power terminal is welded on the insulating substrate in the manner of soldering or ultrasonic wave pressure welding. Because the power module comprises the power terminal in a special structure, the rigidity and the resistance of the power terminal can be balanced very well, and the reliability of a welding point is increased.

Description

technical field [0001] The invention belongs to the field of power electronics and relates to the packaging of power modules, in particular to a power module including special power terminals. Background technique [0002] The power terminals of the power module are usually packaged by the traditional packaging method, and after a long time of operation of this power module, the power terminals are easy to fall off and fail. The main reason is that when the power terminals are subjected to large external stress or During thermal stress, under the action of temperature and thermal stress, the power terminal will fail after shedding. The reason for the shedding is the lack of a stress-relieving structure to offset the influence of the stress caused by the strain of the power terminal on the bottom of the terminal. Contents of the invention [0003] The object of the invention is to design a power module comprising special power terminals. [0004] The invention aims to solv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/00H01L23/48
CPCH01L2224/48091H01L2924/13055
Inventor 金晓行姚礼军吕镇刘志宏
Owner 嘉兴斯达微电子有限公司
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