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High-reliability intelligent-card encapsulating glue and preparation method thereof

A technology of card encapsulation and reliability, applied in chemical instruments and methods, other chemical processes, etc., can solve problems such as difficult to meet the requirements of high reliability, achieve superior water resistance and resistance to cold and heat cycles, shrinkage Low rate, good storage stability

Inactive Publication Date: 2011-05-18
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, the smart card encapsulants on the market are difficult to meet the requirements of high reliability due to reasons such as glass transition temperature (Tg) and water resistance.

Method used

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  • High-reliability intelligent-card encapsulating glue and preparation method thereof
  • High-reliability intelligent-card encapsulating glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Accurately weigh the following raw materials, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexyl carboxylate 50g, functional resin 5g, 1,4-butanediol 2.5g, β-( 3,4-epoxycyclohexyl) ethyltrimethoxysilane 5g drops in reactor, and rotating speed 800 rev / mins, mixes 15 minutes at room temperature, then takes by weighing photoinitiator to be the IHT of Beijing Yingli Science and Technology Development Co., Ltd. - Put 0.5g of PT445 into the reaction kettle under the condition of avoiding light, rotate at 800 rpm, mix at room temperature for 15 minutes to make it a homogeneous solution, then weigh 37g of silicon micropowder, add it into the reaction kettle in three equal batches, The temperature is 20°C, the vacuum degree is -0.07MPa, the rotation speed is 800 rpm, and the mixture is stirred for 2 hours to obtain the product.

Embodiment 2

[0027] Accurately weigh the following raw materials, bis(7-oxabicyclo[4.1.0]3-heptylmethyl)adipate 30g, functional resin 10g, 1,4-butanediol 2g, γ-glycidol Put 5g of oxypropyltrimethoxysilane into the reaction kettle at a speed of 1000 rpm, mix at room temperature for 20 minutes, then weigh the photoinitiator as IHT-PT432 1g from Beijing Yingli Science and Technology Development Co., Ltd. under dark conditions Put it into the reaction kettle at a speed of 1000 rpm, mix at room temperature for 20 minutes to make it into a homogeneous solution, then weigh 52g of silicon micropowder, add it to the reaction kettle in three batches, at a temperature of 20°C and a vacuum of -0.05 MPa, rotating speed 1000 rpm, stirring and mixing for 2 hours to obtain the product.

Embodiment 3

[0029] Accurately weigh the following raw materials, bis(7-oxabicyclo[4.1.0]3-heptylmethyl)adipate 15g, bisphenol A epoxy resin (E51) 10g, functional resin 20g, 1 , 5g of 4-butanediol and 9g of γ-mercaptopropyltrimethoxysilane were put into the reactor at a speed of 1000 rpm, mixed at room temperature for 25 minutes, and then the photoinitiator was weighed as Beijing Yingli Technology Development Co., Ltd. Put 1g of IHT-PT4361g into the reaction kettle under the condition of avoiding light, rotate at 1000 rpm, mix at room temperature for 20 minutes to make it a homogeneous solution, then weigh 30g of silicon micropowder and 10g of quartz powder, and add them to the reaction in three equal batches In the kettle, at a temperature of 20°C, a vacuum degree of -0.05MPa, and a rotation speed of 1000 rpm, stir and mix for 2 hours to obtain the product.

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Abstract

The invention relates to high-reliability intelligent-card encapsulating glue and a preparation method thereof. The high-reliability intelligent-card encapsulating glue comprises the following raw materials in percentage by weight: 30-50 percent of epoxy resin, 5-30 percent of functional resin, 2-20 percent of polylol, 1-20 percent of silane coupling agent, 0.3-4 percent of light trigger and 30-60 percent of filler. The high-reliability intelligent-card encapsulating compound disclosed by the invention has low shrinkage ratio and excellent water resisting property and cold-hot circulation resisting property, effectively ensures the reliability of encapsulated components, conforms to the high-efficiency tempo in modern production due to rapid ultraviolet curing, complies with the trend of environmental protection due to little odor after curing, has good storage stability and is applicable to the encapsulation of an intelligent-card module integrated circuit chip.

Description

technical field [0001] The invention relates to an encapsulating glue and a preparation method thereof, in particular to a high-reliability smart card encapsulating glue and a preparation method thereof. Background technique [0002] At present, the packaging industry is still developing vigorously, and advanced packaging technologies such as BGA (Ball Grid Array), Flip Chip, and CSP (Chip Scale Package) have become mainstream. The development of packaging technology has increasingly stringent requirements on the characteristics of packaging materials, which also drives the development of the packaging material market. [0003] Packaging materials are one of the most important materials in IC packaging. Polymer materials play an important role in this field. The main function is to protect wafers and circuits from the influence and damage of the external environment, so as to prolong the reliability of products. Among them, encapsulation glue is an important packaging mater...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/02C08L63/04C08K3/34C08K3/36C08G59/32C08G59/38C08G59/36C08G59/62C09K3/10
Inventor 王红娟王建斌陈田安
Owner YANTAI DARBOND TECH
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