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Unleaded glass powder used for electronic paste and preparation method thereof

A lead-free glass powder and electronic paste technology, applied in the fields of electronics and glass powder, can solve the problems of increased melting and sealing temperature and softening temperature, decreased chemical stability and wettability, mismatched expansion coefficient, etc. Softening temperature, good adsorption and matching, the effect of good matching

Inactive Publication Date: 2011-04-06
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In order to overcome the problems such as the decrease of chemical stability and wettability, the increase of melting temperature and softening temperature, and the mismatch of expansion coefficients caused by the preparation of glass powder after replacing lead, the present invention provides a lead-free paste for electronic paste. Glass powder and preparation method thereof, realized by the following technical scheme

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] A. Prepare the materials according to the following quality and mix them well:

[0060] Boron trioxide 10 g Silica 9.5 g

[0061] Bismuth trioxide 75g Sodium oxide 0.1g

[0062] Calcium oxide 0.1g Strontium oxide 0.5g

[0063] Titanium dioxide 1.5g Zirconia 0.5g

[0064] Tin oxide 0.8g Aluminium oxide 0.5g

[0065] Antimony trioxide 0.5g calcium fluoride 1g;

[0066] b. The uniformly mixed raw materials in step A are placed at 80° C., heated to 200° C., then kept for 30 minutes, then heated to 1050° C. and kept for 120 minutes, so that the raw materials are fully melted into glass liquid;

[0067] c. The glass liquid obtained in step B is poured into deionized water for quenching, and the glass liquid is sharply cooled in water and broken into small glass particles;

[0068] D. The small glass particles obtained in step C are filtered out, and ball-milled to 320 mesh glass powder to obtain lead-free glass powder for electronic paste.

[0069] The o...

Embodiment 2

[0071] A. Prepare materials according to the following mass percentages and mix them thoroughly:

[0072] Boron trioxide 60g Silica 3.8g

[0073] Bismuth trioxide 30g Sodium oxide 0.1g

[0074] Calcium oxide 1.5g Strontium oxide 0.5g

[0075] Titanium dioxide 2g Zirconia 0.5g

[0076] Tin oxide 0.5g aluminum oxide 0.5g

[0077] Antimony trioxide 0.5g calcium fluoride 0.1g;

[0078] b. The uniformly mixed raw materials in step A are placed at 150° C., heated to 300° C., then kept for 20 minutes, then heated to 1250° C. and kept for 30 minutes, so that the raw materials are fully melted into glass liquid;

[0079] c. The glass liquid obtained in step B is poured into deionized water for quenching, and the glass liquid is sharply cooled in water and broken into small glass particles;

[0080] D. The small glass particles obtained in step C are filtered out, and ball-milled to 400 mesh glass powder to obtain lead-free glass powder for electronic paste.

[0081] Th...

Embodiment 3

[0083] A. Prepare materials according to the following mass percentages and mix them thoroughly:

[0084] Boron trioxide 30g Silica 6.1g

[0085] Bismuth trioxide 41g Sodium oxide 3g

[0086] Calcium oxide 2.9g Strontium oxide 3g

[0087] Titanium dioxide 2 grams Zirconia 2 grams

[0088] Tin oxide 3 grams aluminum oxide 3 grams

[0089] 2 grams of antimony trioxide, 2 grams of calcium fluoride;

[0090] b. The uniformly mixed raw materials in step A are placed at 120° C., heated to 250° C. and then kept for 25 minutes, then heated to 1150° C. and kept for 60 minutes, so that the raw materials are fully melted into glass liquid;

[0091] c. The glass liquid obtained in step B is poured into deionized water for quenching, and the glass liquid is sharply cooled in water and broken into small glass particles;

[0092]D. The small glass particles obtained in step C are filtered out, and ball-milled to 350 mesh glass powder to obtain lead-free glass powder for electronic ...

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Abstract

The invention provides an unleaded glass powder used for electronic paste and a preparation method thereof. The unleaded glass powder is composed of the following components by mass ratio: 10-60% of diboron trioxide, 2.5-30% of silicon dioxide, 30-75% of bismuth trioxide, 0.1-5% of sodium oxide, 0.1-3% of calcium oxide, 0.5-10% of strontium oxide, 1.5-20% of titanium dioxide, 0.5-8% of zirconium oxide, 0.1-5% of stannic oxide, 0.5-6% of aluminium oxide, 0.5-5% of antimonous oxide and 0.1-5% of calcium fluoride, the components are fully mixed to be uniform and then heated to 1050-1250 DEG C, and heat preservation is carried out for 30-120min, so that raw material is fully melted into glass metal, the glass metal is poured into deionized water to be quenched into glass granules, and ball milling into 320-400 meshes is carried out, thus obtaining the unleaded glass powder. The invention provides an unleaded glass powder with low softening temperature, good chemical stability, appropriate expansion coefficient, acid-base resistance, good abrasive resistance, wide sintering temperature range, low manufacturing cost and no toxic heavy metal oxide, and the unleaded glass powder has wide application range.

Description

[0001] technical field [0002] The invention relates to a lead-free glass powder used for electronic paste and a preparation method thereof, belonging to the fields of electronics and glass powder. Background technique [0003] The mass fraction of glass powder in electronic paste can generally reach 5% to 10%. The performance of glass powder directly affects the quality of electronic products. For example, the melting temperature of glass affects the oxidation and deformation of metal parts of electronic products. The expansion coefficient of glass affects its bonding, sealing and tensile strength with the ceramic glass substrate, and the resistivity and dielectric properties of the glass directly affect the quality and life of electronic products. [0004] The vast majority of traditional glass powders contain heavy lead. Because lead glass has a series of characteristics such as high resistance, low dielectric loss, high refractive index and dispersion, and absorption of...

Claims

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Application Information

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IPC IPC(8): C03C12/00
Inventor 甘国友严继康朱华张磊郑娅杜景红易健宏
Owner KUNMING UNIV OF SCI & TECH
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