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Micro-etching solution cyclic regeneration and copper reclamation device

A technology of micro-etching solution and electrolytic regeneration, which is applied to the improvement of process efficiency, photography technology, instruments, etc., can solve the problems of wasting raw materials, environmental hazards, increasing the total amount of solid waste and pollutant discharge, and achieves simple maintenance and lightening The effect of environmental pressure

Inactive Publication Date: 2011-03-23
章晓冬
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The usual way is to discharge it to the wastewater treatment station of the circuit board factory, add alkali to turn it into copper sludge, and then turn it into solid waste and then hand it over to a special environmental protection company for treatment. This not only increases the company's wastewater treatment cost, but also increases solid waste and pollution. It not only wastes raw materials, but also cheaply disposes metal copper in the waste liquid, and at the same time causes certain harm to environmental protection.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] The microetching solution is 200L, the copper ion concentration is 40g / L, the sulfuric acid concentration is 12%, the anode plate is made of iridium oxide coated titanium anode, and the anode current density is set to 10ASD; the cathode plate is made of pure titanium plate, and the cathode current density is set to It is 10ASD, the ambient temperature is 30°C, and the power is turned on for electrolysis operation. The accumulated electrolysis power is 1200Ah, and the theoretical copper deposition amount per Ah of 1066.2g deposited on the cathode plate is 1.185g, which is calculated. Faraday DC electrolysis efficiency of 75%

Embodiment 2

[0016] The microetching solution is 500L, the copper ion concentration is 25g / L, the sulfuric acid concentration is 5%, the anode plate is made of iridium oxide coated titanium anode, and the anode current density is set to 4ASD; the cathode plate is made of pure titanium plate, and the cathode current density is set to It is 8ASD, the ambient temperature is 35 ℃, the power is turned on for electrolysis operation, the accumulated electrolysis electricity is 1000Ah, and the theoretical copper deposition amount per Ah of 1060g deposited on the cathode plate is 1.185g, and the Faraday The DC electrolysis efficiency is 89%.

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Abstract

The invention provides a micro-etching solution cyclic regeneration and copper reclamation device, and relates to a device for reclaiming copper from micro-etching waste solution and a regeneration technique for the waste solution in the printed circuit board industry. The micro-etching waste solution is generally repurchased for extracting copper sulfate crystals by a reclamation company in the current industry, and the discharge of the waste solution causes secondary pollution; and high-purity electrolytic copper is reclaimed by electrolysis technology, and the micro-etching solution can be recycled and does not need discharging so as to fulfill the aims of energy conservation, emission reduction and clean production.

Description

Technical field: [0001] The invention relates to a recovery device for copper in micro-etching waste liquid in the printed circuit board industry and a waste liquid regeneration technology technical background: [0002] As the foundation of the electronics industry, information industry and home appliance industry, the printed circuit board industry, one of the heavy polluting industries, has been transferred to China in the past 20 years, making China's printed circuit board industry maintain an annual growth rate of 10-12% in recent years At present, there are more than 5,000 printed circuit board enterprises, with an annual output of 120 million square meters, ranking second in the world. In the production process of printed circuit boards, the microetching solution is mainly to microetch the copper surface to clean and roughen the copper surface, and help improve the bonding force between the copper surface and dry film, wet film, prepreg and solder resist ink. At prese...

Claims

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Application Information

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IPC IPC(8): C23F1/46C25C1/12
CPCY02P10/20
Inventor 章晓冬
Owner 章晓冬
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